(57) ABSTRACT A semiconductor device includes a first chip package, a heat dissipation
structure and an adapter. The first chip package includes a semiconductor die laterally …

(57) ABSTRACT A semiconductor package includes a circuit substrate, a die, a frame
structure, a heat sink lid and conductive balls. The die is disposed on a front surface of the …

An apparatus for cooling an electronic device is disclosed. In an aspect, the apparatus
includes a vapor chamber coupled to a heat generating component of the electronic device …

A semiconductor device includes a circuit substrate, a semiconductor package, and a
metallic cover. The semiconductor package is disposed on the circuit substrate. The metallic …

A heat sink may include a base having a first surface in a first plane configured to contact a
system on chip (SoC) located on a circuit board. The heat sink may include a plurality of heat …

H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid
state devices; Multistep manufacturing processes thereof all the devices being of a type …