Solder is widely used to connect chips to their packaging substrates in flip chip technology
as well as in surface mount technology. At present, the electronic packaging industry is …

Abstract Replacing Pb-Sn with Pb-free solders is one of the most important issues in the
electronic industry. Melting, dissolution, solidification and interfacial reactions are …

Sn-rich alloys in the Sn-Ag-Cu system are being studied for their potential as Pb-free
solders. Thus, the location of the ternary eutectic involving L,(Sn), Ag 3 Sn and Cu 6 Sn 5 …

Systematic experiments have been performed to study the intragranular nucleation
phenomena of ferrite in Ti-bearing low carbon steels. The fine intragranular acicular ferrite …

Intermetallic compound (IMC) growth during solid-state aging at 125, 150, and 170° C up to
1500 h for four solder alloys (eutectic SnPb, Sn–3.5 Ag, Sn–3.8 Ag–0.7 Cu, and Sn–0.7 Cu) …

Abstract Near-ternary eutectic Sn–Ag–Cu alloys are leading candidates for Pb-free solders.
These alloys have three solid phases: β–Sn, Ag 3 Sn, and Cu 6 Sn 5. Starting from the fully …

The need for new, improved solder alloys and a better understanding of reactions during the
soldering process grows steadily as the need for smaller and more reliable electronic …

The effects of Ag on the microstructure and corrosion behavior of pre-soldering Sn–xAg lead-
free solders, and on the formation of intermetallic layer of the solders with Cu substrate were …

Relationships between microstructural and mechanical aging effects in eutectic PbSn and
Pb-free solder alloy Sn3. 9Ag0. 6Cu are reported and compared. The room temperature …

Aging effects and creep behavior along with microstructure changes in eutectic PbSn and
the lead-free solder alloy Sn3. 9Ag0. 6Cu were studied. The room temperature aged Sn3 …