Board-level drop impact testing is a useful way to characterize the drop durability of the
different soldered assemblies onto the printed circuit board (PCB). The characterization …

Drop-induced failures are most dominant in portable electronic products. In this study,
explicit finite element models have been used to predict the transient dynamic behavior of …

Product level assessment of drop and shock reliability relies heavily on experimental test
methods. Prediction of drop and shock survivability is largely beyond the state-of-art …

Based on the unified creep and plasticity theory, an improved constitutive model is proposed
in this study to describe the uniaxial mechanical behaviour of Sn3. 0Ag0. 5Cu (SAC305) …

The reliability of SnAgCu (SAC)-based alloys has attracted considerable attention following
the restrictions on lead-based alloys in the electronics industry due to their toxic nature …

Portable electronics is subjected to extreme accelerations in shock and drop impact. Product
development cycle times and the cost constraints often restrict the number of design …

Relative damage-index based on the leadfree interconnect transient strain history from
digital image correlation, explicit finite-elements, cohesive-zone elements, and component's …

In this paper, a design-envelope approach based on optical feature extraction techniques
has been investigated for drop and shock survivability of electronic packaging has been …

Electronic packages subjected to drop and shock have been simulated using alternative
theory known as peridynamic theory in the realm of FEM. In peridynamics, problems are …

In spite of a great success of stacked package (PoP) in the market, some reliability issues
have been raised. One of them is a board level reliability evaluation of PoP with 2 nd level …