Light-emitting diodes (LEDs) are considered an ideal substitute for low-efficiency traditional
light sources with broad applications in all scientific disciplines. For the past recent years …

This paper proposes an encapsulation shaping method for white light-emitting diode
packaging, using a silicon substrate with an island structure and using a simple yttrium …

The thermal management of light-emitting diode (LED) packaging modules has become
more important in the past decade, especially for high-powered LED chips, which produce …

This study demonstrates a vertically integrated environment sensor with a fluorescence
quenching based gas sensor [1] and a resistive temperature detector (RTD) using the TSMC …

This letter presents a silicon-based light-emitting diode (LED) packaging module with
integrated red, green, and blue (RGB) color sensors, which can detect the variations in the …

Given the performance decay of high-power light-emitting diode (LED) chips over time and
package condition changes, having a reliable output light for sensitive applications is a point …

A silicon-based packaging platform is developed for the packaging component of a high-
luminosity and high-efficiency multi-chip light-emitting diode (LED) module, which is …

Miniaturization of solid state lighting (SSL) luminaires as well as reduction of packaging and
assembly costs are of prime interest for the SSL lighting industry. A novel silicon based LED …

A noninvasive approach is used to study the die attach layer of chip-on-board (COB)
packaged light-emitting-diodes (LEDs) after temperature cycling. Failure analysis of the die …

It is believed that LEDs will dominate all lighting applications in the near future. Integration
and packaging are the two critical issues that, if resolved, will enable efficient and reliable …