[HTML][HTML] Review of Short-Wavelength Infrared Flip-Chip Bump Bonding Process Technology
J Du, X Zhao, J Su, B Li, X Duan… - Sensors (Basel …, 2025 - pmc.ncbi.nlm.nih.gov
Short-wave infrared (SWIR) imaging has a wide range of applications in civil and military
fields. Over the past two decades, significant efforts have been devoted to developing high …
fields. Over the past two decades, significant efforts have been devoted to developing high …
Indium-based Flip-chip Interconnection by Electroplating Method for Superconducting Quantum 3D Integration Architecture
J Yu, Q Wang, H Wu, Y Zheng, J Fang… - IEEE Electron …, 2024 - ieeexplore.ieee.org
This letter proposes to use electroplating method for manufacturing low cost, high volume
indium bumps. The flip chip bonding process in this work supports a wide process window …
indium bumps. The flip chip bonding process in this work supports a wide process window …
Bonding of Multiple Fine Pitch Flexible Cables to a Single Multi-Chip Module for Cryogenic/Superconductive Computing Applications
Thermocompression bonding of a superconductive flexible cable and a non-
superconductive flexible cable was performed to a single multi-chip module (MCM) test …
superconductive flexible cable was performed to a single multi-chip module (MCM) test …