A review of recent research on heat transfer in three-dimensional integrated circuits (3-D ICs)
Three-dimensional integrated circuits (3-D IC) technology has emerged in the past few
decades, driven in part by the techno-economic difficulties of dimensional scaling and the …
decades, driven in part by the techno-economic difficulties of dimensional scaling and the …
Greencool: An energy-efficient liquid cooling design technique for 3-d mpsocs via channel width modulation
Liquid cooling using interlayer microchannels has appeared as a viable and scalable
packaging technology for 3-D multiprocessor system-on-chips (MPSoCs). Microchannel …
packaging technology for 3-D multiprocessor system-on-chips (MPSoCs). Microchannel …
System-level thermal-aware design of 3D multiprocessors with inter-tier liquid cooling
Rising chip temperatures and aggravated thermal reliability issues have characterized the
emergence of 3D multiprocessor system-on-chips (3D-MPSoCs), necessitating the …
emergence of 3D multiprocessor system-on-chips (3D-MPSoCs), necessitating the …
Optimized micro-channel design for stacked 3-D-ICs
B Shi, A Srivastava - … on Computer-Aided Design of Integrated …, 2013 - ieeexplore.ieee.org
The three dimensional circuit (3-D-IC) achieves high performance by stacking several layers
of active electronic components vertically. Despite its impact on performance improvement, 3 …
of active electronic components vertically. Despite its impact on performance improvement, 3 …
Optimization of the Solid-State Copper Brazing Condition Using Desirability Function and Genetic Algorithm
This research studies on optimization of solid-state copper brazing condition and
comparatively investigates the ability of the desirability function and genetic algorithm (GA) …
comparatively investigates the ability of the desirability function and genetic algorithm (GA) …
STREAM: Stress and thermal aware reliability management for 3-D ICs
Accurate and fast reliability management is important for 3-D integrated circuits (3-D ICs)
because of the severe on-chip thermal and reliability problems. However, due to the lack of …
because of the severe on-chip thermal and reliability problems. However, due to the lack of …
Power-thermal modeling and control of energy-efficient servers and datacenters
Power-Thermal Modeling and Control of Energy-Efficient Servers and Datacenters |
SpringerLink Skip to main content Advertisement SpringerLink Account Menu Find a journal …
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[图书][B] The art of software thermal management for embedded systems
M Benson - 2014 - Springer
Thermal performance is the new bottleneck in embedded systems design. As processing
requirements increase, and physical device sizes continue to decrease, it is becoming more …
requirements increase, and physical device sizes continue to decrease, it is becoming more …
Self-convectional three-dimensional integrated circuit cooling system using micro flat heat pipe for portable devices
N Kim, S Kim - Heat transfer engineering, 2014 - Taylor & Francis
A self-convectional three-dimensional integrated circuit (3D IC) cooling system using micro
flat heat pipes (MFHP) was proposed and the electrothermal behavior of the proposed …
flat heat pipes (MFHP) was proposed and the electrothermal behavior of the proposed …
Temperature-aware design and management for 3D multi-core architectures
Vertically-integrated 3D multiprocessors systems-on-chip (3D MPSoCs) provide the means
to continue integrating more functionality within a unit area while enhancing manufacturing …
to continue integrating more functionality within a unit area while enhancing manufacturing …