Fluorinated graphene (FG), as an emerging member of the graphene derivatives family, has
attracted wide attention on account of its excellent performances and underlying …

Effective thermal management is quite urgent for electronics owing to their ever-growing
integration degree, operation frequency and power density, and the main strategy of thermal …

The low thermal conductivity coefficient (λ) of polyimide (PI) films are limiting their
application in high-power electronic equipment, and the disordered alignment of fillers …

Graphite oxide (GO) and cetyltrimethylammonium bromide (CTAB) modified multi-walled
carbon nanotubes (m-MWCNTs) are utilized to fabricate “Line-Plane”-like hetero-structured …

The ability to change material properties through phase engineering has long been sought,
with the goal of ad hoc tunability of the physical and chemical properties of the transformed …

Research on electronic packaging materials with high electromagnetic interference (EMI)
shielding, thermal conductivity, and electrical insulating properties has been flourishing in …

With the rapid development of portable electronics, the demand for flexible shielding and
thermal management materials is increasing steadily. Herein, we reported a scalable …

Spacecraft materials are a key limiting factor for the rapid development of the aerospace
exploration field. In an advanced spacecraft, superior multi-functional material with thermal …

With the development of microelectronic devices having miniaturized and integrated
electronic components, an efficient thermal management system with lightweight materials …

With the rapid development of wearable electronic devices, multifunctional ultrarobust,
thermoconductive, nonflammable, and electromagnetic interference (EMI) shielding films …