The reliability of an electronic assembly is typically limited by the failure of one of the solder
interconnections. One of the key factors that define the quality of solder interconnections is …

The reliability of an electronic product highly attributes to the fatigue failure of an
interconnected solder joint. The normal operating temperature for many electronic …

Fatigue failure of interconnected solder joints is a critical consideration for the reliability of an
electronic product. Commonly, fatigue properties of solder materials are investigated using …

In this paper, a direct comparison was conducted between SnPb and lead-free solder joints
focused on long-term thermal cycling reliability after being exposed to high-temperature …

Fatigue failure of interconnected solder joints determines the reliability of an electronic
product. To give a proper and accurate estimation of the fatigue life of Ball Grid Array (BGA) …

Mechanical Properties of Micro Alloyed SAC Lead-Free Solder with Bi For Future
Electronics by Mohamed El Amine Belhadi A maste Page 1 Mechanical Properties of Micro …