US8877648B2 - Methods of forming printable integrated circuit devices by selective etching to
suspend the devices from a handling substrate and devices formed thereby - Google Patents …

Low temperature, multi-layered, planar microshells for encapsulation of devices such as
MEMS and microelectronics. The microshells include a planar perforated pre-sealing layer …

(57) ABSTRACT A Micro-Electro-Mechanical System (MEMS). The MEMS includes a lower
chamber with a wiring layer and an upper chamber which is connected to the lower …

US PATENT DOCUMENTS 6,936,494 B2 8/2005 Cheung 6,953,985 B2 10/2005 Lin et al.
6,988,789 B2 1/2006 Silverbrook 6,991,953 B1 1/2006 Bruner et al. 7,002,436 B2 2/2006 …

A method of forming at least one Micro-Electro-Mechanical System (MEMS) cavity includes
forming a first sacrificial cavity layer over a wiring layer and substrate. The method further …

(57) ABSTRACT A method of forming at least one Micro-Electro-Mechanical System (MEMS)
cavity includes forming a first sacrificial cavity layer over a lower wiring layer. The method …

(57) ABSTRACT A method of forming a Micro-Electro-Mechanical System (MEMS) includes
forming a lower electrode on a first insu lator layer within a cavity of the MEMS. The method …

6,143,638 A* 1 1/2000 Bohr........................ 438. 612 2008/0014663 A1 1/2008 HSu et al. 6,
160,230 A 12/2000 McMillan et al. 2008/0050676 A1 2/2008 HOShino 6,352,917 B1 3/2002 …

Microshells for encapsulation of devices such as MEMS and microelectronics. In an
embodiment, the microshells include a planar perforated pre-sealing layer, below which a …

A method of forming at least one Micro-Electro-Mechanical System (MEMS) includes forming
a lower sacrificial material used to form a lower cavity. The method further includes forming a …