Driven by the increasing demand for high-throughput communication links and high-
resolution radar sensors, the development of future wireless systems pushes at ever greater …

Continuous demands to develop advanced radio-frequency transmission at higher
frequencies have initiated glass-based materials as a substrate in radio-frequency micro …

The wonders of modern technologies may seem to be achieved by the development of
exotic materials such as Si and GaN single crystals, graphene, and nano-materials …

A double-sided and ultrathin 3-D glass interposer with through package vias (TPVs) at same
pitch as through silicon vias (TSVs) in silicon interposers is developed to provide a …

Formation of multiple through-holes arrays in a 400 μm thick silica substrate is reported for
the first time by a cost-effective electrochemical discharge machining (ECDM). Customized …

Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit
Boards and Packaging presents the electromagnetic modelling and design of three major …

This article addresses the gas bubble entrapment issue for the first time when a multi-tip tool
array (MTA) is used in electrochemical discharge machining (ECDM). During the …

The evolution of electronic packaging technology towards the adoption of glass substrates
marks a significant advancement in overcoming the constraints posed by traditional organic …

Glass-based packaging presents unique opportunities for supporting 5G and beyond
frequencies. In this work, we present the first broadband characterization results for the …

This letter presents the first demonstration of substrate integrated waveguide (SIW) filters in
glass interposers for-band (110–170 GHz). The material stack-up consists of 100--thick …