For over 20 years, wire sawing has been the primary method used for slicing ingots of
silicon, sapphire, and silicon carbide into wafer substrates. Fixed diamond wire sawing has …

Diamond wire sawing is one of the abrasive machining processes. The cutting tool is a tiny
steel wire coated with a large number of diamond grits. Although wire saw is widely used for …

This paper presents a method of automatic defect inspection for the photovoltaic industry,
with a special focus on multicrystalline solar wafers. It presents a machine vision-based …

Diamond abrasive-coated wire is a tool for the precise multi-wire sawing of mono-crystal
ingots to manufacture substrates. This tool is used to cut hard materials such as silicon …

In this study, the possibility of using inkjet printing in the fabrication of a conductive seed
pattern on a textured silicon solar wafer is investigated. Firstly, solar cell wafers were coated …

Gegenstand dieser Arbeit ist die Entwicklung eines Modells zur techno-ökonomischen
Bewertung von Produktionstechnologien und darauf basierender Prozessketten entlang der …

Two-step metallization processes have been proposed to achieve high-efficiency silicon
solar cells, where the front-side grids are formed by silver plating after the formation of a …

Manufacturing technologies in the semiconductor industry put high demands on accuracy,
especially for the initial steps of wafering. ID grinding has established itself as a cost …

Abstract (DE) In der vorliegenden Arbeit wurden experimentelle Untersuchungen zu
Material begrenzenden Einflüssen beim Multidrahtsägen von Silicium unter Verwendung …

The metallization of a multi-crystalline silicon solar cell has been challenged because the
thickness reduction of a solar cell wafer decreases the breaking force of a solar cell wafer …