[HTML][HTML] Microstructure evolution at the interface between Cu and eutectic Sn–Bi alloy with the addition of Ag or Ni
O Minho, Y Tanaka, E Kobayashi - Journal of Materials Research and …, 2023 - Elsevier
The study investigated the growth kinetics and rate-controlling processes of intermetallic
layers formed at the interface between Cu and eutectic Sn–Bi alloys with Ag or Ni addition at …
layers formed at the interface between Cu and eutectic Sn–Bi alloys with Ag or Ni addition at …
Growth behavior of intermetallic layers at the interface between Cu and eutectic Sn–Bi by grain boundary diffusion with the grain growth at solid-state temperatures
O Minho, Y Tanaka, E Kobayashi - Intermetallics, 2023 - Elsevier
The growth kinetics and rate-controlling processes of intermetallic layers formed in Cu/(Sn-
58 wt% Bi) diffusion couples were investigated. Isothermal annealing of diffusion couples …
58 wt% Bi) diffusion couples were investigated. Isothermal annealing of diffusion couples …
Crystallinity of Co-P coating on microstructure and mechanical properties of Co-Sn intermetallic compounds at Sn-Ag/Co-P/Cu Interface
S Liu, L Ma, C Zhen, Y Wang, D Li, F Guo - Materials Characterization, 2022 - Elsevier
In advanced microelectronic packaging technology, the interfacial brittleness of Cu/Sn
solder joints puts forward higher requirements for high-performance diffusion barriers …
solder joints puts forward higher requirements for high-performance diffusion barriers …
Investigation of the rate-controlling process of intermetallic layer growth at the interface between ferrous metal and molten Al–Mg–Si alloy
O Minho, K Sato, E Kobayashi - Intermetallics, 2023 - Elsevier
In this study, we focused on unraveling the intricate world of intermetallic compound
formation at the interface of solid Fe and liquid Al–Mg–Si alloy. Our primary aim was to shed …
formation at the interface of solid Fe and liquid Al–Mg–Si alloy. Our primary aim was to shed …
[HTML][HTML] Strategies for solder joints with high shear strength, slow interfacial consumption, ductile intermetallic compounds using hybrid crystalline-amorphous Co-P …
S Liu, L Ma, C Zhen, Y Wang, D Li, F Guo - Materials & Design, 2022 - Elsevier
Crystalline and amorphous cobalt-phosphorus (Co-P) coatings have their own advantages
in interfacial diffusion resistance and mechanical ductility of solder joints, respectively, but it …
in interfacial diffusion resistance and mechanical ductility of solder joints, respectively, but it …
[HTML][HTML] Influence of carbon nanotubes on the morphology of Cu6Sn5 in Cu/(Sn–Ag–Cu) solder joints
M Oh, H Iwamoto, E Kobayashi - Results in Materials, 2024 - Elsevier
This study delves into the intricate interaction between multi-walled carbon nanotubes
(MWCNTs) and the Sn–Ag–Cu solder system, highlighting its relevance in lead-free …
(MWCNTs) and the Sn–Ag–Cu solder system, highlighting its relevance in lead-free …
[HTML][HTML] Understanding intermetallic compound growth at Ag/Zn interfaces: Kinetics and mechanisms
M Oh, H Sakaguchi, E Kobayashi, M Kajihara - Intermetallics, 2024 - Elsevier
This study explores the growth behavior and rate-controlling processes of intermetallic
compounds at Ag/Zn diffusion couple interfaces. Through experimental observations and …
compounds at Ag/Zn diffusion couple interfaces. Through experimental observations and …
Two-Step Solid State Synthesis of Medium Entropy LiNi0.5Mn1.5O4 Cathode with Enhanced Electrochemical Performance
W Wu, S Zuo, X Zhang, X Feng - Batteries, 2023 - mdpi.com
Solid state reaction is widely used in the synthesis of electrode materials, due to its low cost
and good scalability. However, the traditional solid-state reaction is not suitable for the …
and good scalability. However, the traditional solid-state reaction is not suitable for the …
Experimental observation of diffusion reaction in the (Sn-Ag)/Cu system at solid-state temperatures
M Nakayama, MO, M Kajihara - Journal of Electronic Materials, 2019 - Springer
The diffusion reaction kinetics for Sn-Ag alloys with pure Cu has been examined
experimentally to determine the effects of adding Ag to Sn on the growth behavior of …
experimentally to determine the effects of adding Ag to Sn on the growth behavior of …
Compound growth due to reactive diffusion between Solid-Ni and Liquid-Zn
S Murakami, M Kajihara - MATERIALS TRANSACTIONS, 2018 - jstage.jst.go.jp
To examine the kinetics of the reactive diffusion in the solid-Ni/liquid-Zn system, an
isothermal bonding technique was used to prepare semi-infinite Ni/Zn diffusion couples. The …
isothermal bonding technique was used to prepare semi-infinite Ni/Zn diffusion couples. The …