Advances on thermally conductive epoxy‐based composites as electronic packaging underfill materials—a review
The integrated circuits industry has been continuously producing microelectronic
components with ever higher integration level, packaging density, and power density, which …
components with ever higher integration level, packaging density, and power density, which …
Unmanned surface vehicles: From a hull design perspective
An autonomous surface vehicle (USV) offers wide applications and is a demanding
technology in the fast-developing era. Even though comprehensive studies have been …
technology in the fast-developing era. Even though comprehensive studies have been …
[HTML][HTML] Interfacial engineering of epoxy/silica nanocomposites by amino-rich polyethyleneimine towards simultaneously enhanced rheological and thermal …
As electronic devices move toward miniaturization and high-degree integration, it becomes
imperative to use nano-sized silica as a reinforcing filler for epoxy resin in modern …
imperative to use nano-sized silica as a reinforcing filler for epoxy resin in modern …
High content of spherical nanosilica filled epoxy resin master batch with low viscosity and superior thermomechanical performance
Spherical nanosilica is reckoned as an indispensable filler in electronic encapsulation to
improve the thermomechanical performance of epoxy resin matrix. How to achieve higher …
improve the thermomechanical performance of epoxy resin matrix. How to achieve higher …
[HTML][HTML] Effect of flip-chip ball grid array structure on capillary underfill flow
HH Hung, YC Cheng, SJ Hwang, HJ Chang… - Results in …, 2024 - Elsevier
During the capillary underfill (CUF) process in flip-chip packaging, issues like incomplete
filling, voids, wire sweeping, and overflow can impact product reliability and the relatively …
filling, voids, wire sweeping, and overflow can impact product reliability and the relatively …
Prediction of the void formation in no-flow underfill process using machine learning-based algorithm
This paper investigated the variation variables on the void formation in the no-flow underfill
process. A total of 96 distinct no-flow underfill cases were numerically simulated to …
process. A total of 96 distinct no-flow underfill cases were numerically simulated to …
On the influence of lid materials for flip-chip ball grid array package applications
MB Jeronimo, J Schindele, H Straub, PJ Gromala… - Microelectronics …, 2023 - Elsevier
Autonomous driving is a key vehicle capability for future mobility solutions that relies on the
reliability of its high-performance vehicle computer. As for any electronics for automotive …
reliability of its high-performance vehicle computer. As for any electronics for automotive …
Correlation study on voiding in underfill of large quantity ball grid array chip using machine learning
This paper investigates voiding issues in the underfilling process of ball grid array (BGA)
chip packages under various parameter settings such as chip conveyor speed, valve …
chip packages under various parameter settings such as chip conveyor speed, valve …
Numerical simulation of laser soldering process on pin through hole (PTH)
The increasing demands in the miniaturization of microelectronic products promotes the
automation of electronic assembly and manufacturing process such as laser soldering to …
automation of electronic assembly and manufacturing process such as laser soldering to …
Microscale underfill dynamics and void formation of high-density flip-chip packaging: Experiments and simulations
E Wu, B Wang, S Zhang, Y Su, X Chen - Physics of Fluids, 2024 - pubs.aip.org
This research focuses on developing high-fidelity experimental and numerical models to
analyze microscale underfill dynamics and void formation in high-density flip-chip …
analyze microscale underfill dynamics and void formation in high-density flip-chip …