With the introduction and proliferation of Cu wire bonding, the cost of wire bonding packages
is greatly reduced compared to traditional Au wire bonding. Wire bonding is still the most …

With all the advances in 2.5 D and 3D packaging, wire bonding is still the most popular
interconnect technology and the workhorse of the industry. Wire bonding technology has …

热超声键合是目前最重要的引线键合技术, 在电子封装领域中有着广泛的应用.
面对封装密度不断提高, 焊点节距不断下降和成本持续降低等挑战, 工程技术人员需要全面了解 …

Providing more functionality at a lower cost is the driving force in the semiconductor industry.
Among the different interconnect technologies such as wire bonding, flip chip and TAB …

The high price of Au has motivated many to look for alternative bonding wire materials in the
field of microelectronics packaging. In the present study, the reliability performance of …

Package footprint reduction, environmental protection law compliance and manufacturing
cost reduction constrains are moving the semiconductor industry toward the mass adoption …

In this chapter, more details of the wire bonding process will be discussed. The wire bonding
process is discussed in four areas including free air ball (FAB) formation process, first bond …