Understanding polishing mechanisms in water-lubricated environments has an important
guiding value for surface engineering of precision devices. This work reveals the chemical …

Traditional chemical mechanical polishing (CMP) normally employs noxious slurries,
leading to pollution to the environment. It is a challenge to achieve atomic surfaces of nickel …

SiO2 nanoparticle prepared through sol–gel method was directly coated with CeO2 by
means of chemical precipitation technique. X-ray diffraction (XRD), differential scanning …

Molecular dynamics simulation is employed to analyze the effect of sliding, rolling and
oscillating movements on nanotribology properties of a diamond abrasive on a silicon …

Yttrium aluminum garnet (YAG) single crystal has become a promising substrate for the high-
power solid-state laser. It needs to be processed into a defect-free surface by chemical …

In this paper, a detailed analysis is presented to characterize the performance of colloidal
silica abrasives based slurry with different abrasive sizes on CMP of hexagonal 4H-SiC …

The controllable and facile synthesis of SiO 2@ CeO 2 core-shell (CS) composite
nanoparticles is crucial for various applications, ie, chemical mechanical polishing (CMP) …

In this paper, a novel non-noble metal catalyst (Fe-N x/C) is used to improve the removal
mass of sapphire as well as obtain atomically smooth sapphire wafer surfaces. The results …

Chemical-mechanical polishing (CMP) has drawn significant attention as one of the most
advanced techniques for achieving an atomic-level smooth surface. However, the …

In this paper, dodecylbenzenesulfonic acid (DBSA) and isomeric alcohol polyoxyethylene
ether (iAEO) are tested as additives to basic silica-based slurries with the goal of reducing …