Two-dimensional semiconductors and transistors for future integrated circuits

L Yin, R Cheng, J Ding, J Jiang, Y Hou, X Feng… - ACS …, 2024 - ACS Publications
Silicon transistors are approaching their physical limit, calling for the emergence of a
technological revolution. As the acknowledged ultimate version of transistor channels, 2D …

Review of circuit level leakage minimization techniques in CMOS VLSI circuits

R Lorenzo, S Chaudhury - IETE Technical review, 2017 - Taylor & Francis
Ever increasing demand for portable and battery-operated systems has led to aggressive
scaling. While technology scaling facilitates faster and high-performance devices, at the …

Reliability challenges for CMOS technology qualifications with hafnium oxide/titanium nitride gate stacks

A Kerber, EA Cartier - IEEE Transactions on Device and …, 2009 - ieeexplore.ieee.org
It has been demonstrated that the introduction of HfO 2/TiN gate stacks into CMOS
technologies provides the means to continue with traditional device gate length scaling …

The smallest engine transforming humanity: the past, present, and future

K Kim - 2021 IEEE International Electron Devices Meeting …, 2021 - ieeexplore.ieee.org
Semiconductors, amongst one of the most important innovations of the 20 th century, have
played a pivotal role in the creation of a digitalized, modern industrial society. The global …

Voltage Ramp Stress for Bias Temperature Instability Testing of Metal-Gate/High- Stacks

A Kerber, SA Krishnan… - IEEE Electron Device …, 2009 - ieeexplore.ieee.org
A novel voltage-ramp-stress (VRS) methodology is introduced for bias temperature
instability testing of metal-gate/high-k (MG/HK) CMOS devices. Results from VRS are …

Compact design of low power standard ternary inverter based on OFF-state current mechanism using nano-CMOS technology

S Shin, E Jang, JW Jeong, BG Park… - IEEE Transactions on …, 2015 - ieeexplore.ieee.org
We propose a novel standard ternary inverter (STI) based on nanoscale CMOS technology
for a compact design of multivalued logic. Using the gate bias independent OFF-state …

A discussion on SRAM circuit design trend in deeper nanometer-scale technologies

H Yamauchi - IEEE Transactions on Very Large Scale …, 2009 - ieeexplore.ieee.org
This paper compares area scaling capabilities of many kinds of SRAM margin-assist
solutions for VT variability issues, which are based on various efforts by not only the cell …

High-κ/Metal Gate Science and Technology

S Guha, V Narayanan - Annual Review of Materials Research, 2009 - annualreviews.org
High-κ/metal gate technology is on the verge of replacing conventional oxynitride dielectrics
in state-of-the-art transistors for both high-performance and low-power applications. In this …

[HTML][HTML] A Feasible Alternative to FDSOI and FinFET: Optimization of W/La2O3/Si Planar PMOS with 14 nm Gate-Length

SK Mah, PJ Ker, I Ahmad, NF Zainul Abidin… - Materials, 2021 - mdpi.com
At the 90-nm node, the rate of transistor miniaturization slows down due to challenges in
overcoming the increased leakage current (Ioff). The invention of high-k/metal gate …

Parasitic capacitances: Analytical models and impact on circuit-level performance

L Wei, F Boeuf, T Skotnicki… - IEEE transactions on …, 2011 - ieeexplore.ieee.org
Parasitic capacitances have become a main issue for advanced technology nodes. In this
paper, we develop analytical models for parasitic capacitance components for several …