A review of mechanical properties of lead-free solders for electronic packaging
H Ma, JC Suhling - Journal of materials science, 2009 - Springer
The characterization of lead-free solders, especially after isothermal aging, is very important
in order to accurately predict the reliability of solder joints. However, due to lack of …
in order to accurately predict the reliability of solder joints. However, due to lack of …
Influence of nanoparticle addition on the formation and growth of intermetallic compounds (IMCs) in Cu/Sn–Ag–Cu/Cu solder joint during different thermal conditions
Nanocomposite lead-free solders are gaining prominence as replacements for conventional
lead-free solders such as Sn–Ag–Cu solder in the electronic packaging industry. They are …
lead-free solders such as Sn–Ag–Cu solder in the electronic packaging industry. They are …
Interfacial reaction issues for lead-free electronic solders
The interfacial reactions between Sn-based solders and two common substrate materials,
Cu and Ni, are the focuses of this paper. The reactions between Sn-based solders and Cu …
Cu and Ni, are the focuses of this paper. The reactions between Sn-based solders and Cu …
Reliability of the aging lead free solder joint
Solder materials demonstrate evolving microstructure and mechanical behavior that
changes significantly with environmental exposures such as isothermal aging and thermal …
changes significantly with environmental exposures such as isothermal aging and thermal …
The influence of elevated temperature aging on reliability of lead free solder joints
The microstructure, mechanical response, and failure behavior of lead free solder joints in
electronic assemblies are constantly evolving when exposed to isothermal aging and/or …
electronic assemblies are constantly evolving when exposed to isothermal aging and/or …
Reduction of lead free solder aging effects using doped SAC alloys
The microstructure, mechanical response, and failure behavior of lead free solder joints in
electronic assemblies are constantly evolving when exposed to isothermal aging and/or …
electronic assemblies are constantly evolving when exposed to isothermal aging and/or …
Growth behavior of intermetallic compounds and early formation of cracks in Sn-3Ag-0.5 Cu solder joints under extreme temperature thermal shock
R Tian, C Hang, Y Tian, L Zhao - Materials Science and Engineering: A, 2018 - Elsevier
The microstructure evolution and growth mechanism of interfacial intermetallic compounds
(IMCs) as well as the mechanism for early formation of cracks in Sn-3Ag-0.5 Cu solder joints …
(IMCs) as well as the mechanism for early formation of cracks in Sn-3Ag-0.5 Cu solder joints …
The effects of aging temperature on SAC solder joint material behavior and reliability
The effects of aging on mechanical behavior of lead free solders have been examined by
performing creep tests on four different SAC alloys (SAC105, SAC205, SAC305, SAC405) …
performing creep tests on four different SAC alloys (SAC105, SAC205, SAC305, SAC405) …
Thermal aging effects on the thermal cycling reliability of lead-free fine pitch packages
The microstructure, mechanical response, and failure behavior of lead-free solder joints in
electronic assemblies are constantly evolving when exposed to isothermal aging and/or …
electronic assemblies are constantly evolving when exposed to isothermal aging and/or …
The effects of aging on the cyclic stress-strain behavior and hysteresis loop evolution of lead free solders
Solder joints in electronic assemblies are typically subjected to thermal cycling, either in
actual application or in accelerated life testing used for qualification. Mismatches in the …
actual application or in accelerated life testing used for qualification. Mismatches in the …