This article focuses on failure modes and lifetime testing of IGBT modules being one of the
most vulnerable components in power electronic converters. IGBT modules have already …

Miniaturization as well as manufacturing processes that electronics devices are subjected to
often results in to increase in operational parameters such as current density, temperature …

High-reliability life design process not only can ensure system safety in service, but also can
provide scientific life management during the maintenance period. The objective of the …

The quantity and variety of parameters involved in the failure evolutions in solder joints
under a thermo-mechanical process directs the reliability assessment of electronic devices …

Despite the rapid progression of silicon carbide (SiC) power devices, the thermal
characteristic evaluation during power cycling at high temperature (> 200° C) is an issue. In …

The IMC (interfacial intermetallic compound) produced by the metallurgical reaction
between the solder and the Cu plate enables the packaging of IGBT (insulated gate bipolar …

This study focuses on the realization of rapid Ag sintering in 10 minutes under various
temperature conditions without pressure in the air. In each temperature range from 175° C to …

Rapid and precise reliability evaluation of electronic circuits plays a key role in the design
stage of the electronic systems. The task becomes even more difficult when several major …

Rapid reliability analysis of the solder joints in the electronic devices identifies as an
appeared gap in the design stage. This paper demonstrates the feasibility of employing the …

Costly and time-consuming approaches for solder joint lifetime estimation in electronic
systems along with the limited availability and incoherency of data challenge the reliability …