Manufacturing method of image sensing device
P Sun, X Wang, S Hu - US Patent 11,107,856, 2021 - Google Patents
(57) ABSTRACT A manufacturing method of an image sensing device includes the following
steps. A substrate is provided. At least one image sensing unit is disposed in the substrate. A …
steps. A substrate is provided. At least one image sensing unit is disposed in the substrate. A …
Radiation Hardness of Foundry NVM Technologies
E Pikhay, C Calligaro, Y Roizin - Rad-hard Semiconductor …, 2022 - taylorfrancis.com
The distinguishing process features of radiation-hard foundry platforms are analyzed and
physical mechanisms responsible for radiation hardness of NVM are specified, including the …
physical mechanisms responsible for radiation hardness of NVM are specified, including the …