The objective of this review is to study the interfacial intermatallic compounds (IMCs)
between Sn–Ag–Cu based solders and common substrates, which play a crucial role in …

This paper reviews the function and importance of Sn‐Ag‐Cu solder alloys in electronics
industry and the interfacial reaction of Sn‐Ag‐Cu/Cu solder joint at various solder forms and …

Page 1 PRINCIPLES OF SOLDERING ЛОК Giles Humpston David M. Jacobson ASM
INTERNATIONAL The Materials Information Society Page 2 Principles of Soldering Giles …

When lead-free solder alloys mix with lead-free component and board metallizations during
reflow soldering, the solder interconnections become multicomponent alloy systems whose …

The wetting of I-Ag (immersion silver) and I-Sn (immersion tin) printed-circuit-board (PCB)
finishes by Sn/Ag/Cu and eutectic Sn/Pb solders was studied in this work with Ni/Au …

Failure modes and mechanisms under mechanical shock loading were studied by
employing the statistical and fractographic research methods, and the finite element (FE) …

The worldwide transition to lead-free electronics has increased the usage of several lead-
free pad finishes for electronic assembly manufacturers, including immersion silver …

With the miniaturization of the electronic devices, the spacing among the circuit traces on
printed circuit boards (PCB) keeps reducing, which increases the risk of insulation failure …

This paper explores the effects of Germanium (Ge) addition on the wetting behavior, copper
dissolution, IMC formation, microstructure and mechanical behavior of SnCu alloy. Static …

The reliability of lead-free electronic assemblies under thermal cycling was investigated.
Thin small outline package (TSOP) devices with FeNi leads were reflow soldered on FR4 …