Underfill flow in flip-chip encapsulation process: a review
The scope of review of this paper focused on the precuring underfilling flow stage of
encapsulation process. A total of 80 related works has been reviewed and being classified …
encapsulation process. A total of 80 related works has been reviewed and being classified …
Prediction of the void formation in no-flow underfill process using machine learning-based algorithm
This paper investigated the variation variables on the void formation in the no-flow underfill
process. A total of 96 distinct no-flow underfill cases were numerically simulated to …
process. A total of 96 distinct no-flow underfill cases were numerically simulated to …
Correlation study on voiding in underfill of large quantity ball grid array chip using machine learning
This paper investigates voiding issues in the underfilling process of ball grid array (BGA)
chip packages under various parameter settings such as chip conveyor speed, valve …
chip packages under various parameter settings such as chip conveyor speed, valve …
Numerical simulation of laser soldering process on pin through hole (PTH)
The increasing demands in the miniaturization of microelectronic products promotes the
automation of electronic assembly and manufacturing process such as laser soldering to …
automation of electronic assembly and manufacturing process such as laser soldering to …
No-flow underfill: Effect of chip placement speed on the void formation using numerical method
No-flow underfill process can enhance the production lead time since the curing and reflow
of solder interconnect and underfill are achieved simultaneously. Additionally, no-flow …
of solder interconnect and underfill are achieved simultaneously. Additionally, no-flow …
Deep learning and analytical study of void regional formation in flip-chip underfilling process
Purpose This paper aims to study the relationship between the ball grid array (BGA) flip-chip
underfilling process parameter and its void formation region. Design/methodology/approach …
underfilling process parameter and its void formation region. Design/methodology/approach …
Capillary Underfill Flow Simulation as a Design Tool for Flow-Optimized Encapsulation in Heterogenous Integration
LC Stencel, J Strogies, B Müller, R Knofe, C Borwieck… - Micromachines, 2023 - mdpi.com
As the power electronics landscape evolves, pushing for greater vertical integration,
capillary underfilling is considered a versatile encapsulation technique suited for iterative …
capillary underfilling is considered a versatile encapsulation technique suited for iterative …
Correlation Study on Voiding in Underfill of Large Quantity Ball Grid Array Chip Using Machine Learning
This paper investigates voiding issues in the underfilling process of ball grid array (BGA)
chip packages under various parameter settings such as chip conveyor speed, valve …
chip packages under various parameter settings such as chip conveyor speed, valve …
Two-Phase Flow Simulation of Capillary Underfilling as a Design Tool for Heterogenous Integration
LC Stencel, J Strogies, R Knofe, B Müller… - … and Multi-Physics …, 2023 - ieeexplore.ieee.org
Encapsulation is gaining relevance for the miniaturization of power modules to enhance
dielectric, mechanical, and thermomechanical reliability. Capillary underfill is a flexible …
dielectric, mechanical, and thermomechanical reliability. Capillary underfill is a flexible …
Study of different dispensing patterns of No-flow underfill using numerical and experimental methods
MN Nashrudin, A Abas… - Journal of …, 2021 - asmedigitalcollection.asme.org
The conventional capillary underfill process has been a common practice in the industry,
somehow the process is costly and time-consuming. Thus, no-flow underfill process is …
somehow the process is costly and time-consuming. Thus, no-flow underfill process is …