With the high miniaturization and integration of micro-electro-mechanical systems, micro-
satellite, lasers, and high-voltage electrical appliances, the heat transfer of electronic …

The usage of liquid-cooled microchannel heat dissipation devices is gaining importance in
thermal management of electronic components owing to miniaturization. The development …

The most widely used type of heat transfer in applications is convection heat transfer, and
both natural and forced convection modes have an effect in total heat transfer to a certain …

Jet impingement and microchannel cooling as effective cooling methods have been widely
employed for thermal management of high heat flux electronics. In this work, a novel hybrid …

In this paper, a 3D battery pack (B-PK) containing 16 battery cells (BCL) with aligned and
non-aligned arrangements is simulated. The batteries are 18,650 lithium-ion cylindrical …

High-performance and miniaturized modern electronic devices demand a high value of heat
dissipation. The compactness of Microchannel Heat Sinks (MCHS) and other favourable …

In this paper, nine Microchannel Heat sinks (MCHs) all with channel lengths of 20 mm and
heights of 1 mm but with different aspect ratios 1.33; 2 and 4, wall thicknesses 0.25–0.75 …

For dissipating the increasing heat in high flux microelectronic device, an original
microchannel heat sink with staggered triangular ribs induced vortex flow is designed. In this …

Micro/mini-channel heat sinks (MCHSs) are currently projected as an advance cooling
solution for heat dissipation in the high heat flux devices. Triangular prism (TP) has a special …

The present paper investigates the influence of using two grooved channel geometries on
the hydrothermal performance of a helical microchannel heat sink. The results were …