Impurity and alloying effects on interfacial reaction layers in Pb-free soldering
The objective of this review is to study the effect of minor alloying and impurity elements,
typically present in electronics manufacturing environment, on the interfacial reactions …
typically present in electronics manufacturing environment, on the interfacial reactions …
Nucleation and Location of Kirkendall Voids at the Tin‐Based Solder/Copper Joint: A Review
Void nucleation is a critical issue in wetting because it negatively impacts the solder joint
and diminishes its electrical and mechanical properties. Generally, the Kirkendall effect …
and diminishes its electrical and mechanical properties. Generally, the Kirkendall effect …
Structural, electronic, and elastic properties of orthorhombic, hexagonal, and cubic Cu3Sn intermetallic compounds in Sn–Cu lead-free solder
In order to obtain a better understanding of the phase stabilities and mechanical behaviors
of Cu 3 Sn compounds, we performed first-principles calculations to predict the structural …
of Cu 3 Sn compounds, we performed first-principles calculations to predict the structural …
Wettability and interfacial reactions of Sn–Ag–Cu/Cu and Sn–Ag–Ni/Cu solder joints
The effects of Cu and Ni additions on the wettability and interfacial reaction of Sn–Ag solder
with Cu substrate were investigated. The wettability of the Sn–3.0 Ag–0.5 Cu (or Ni) solder …
with Cu substrate were investigated. The wettability of the Sn–3.0 Ag–0.5 Cu (or Ni) solder …
IMC growth of Sn-3.5 Ag/Cu system: Combined chemical reaction and diffusion mechanisms
OM Abdelhadi, L Ladani - Journal of Alloys and Compounds, 2012 - Elsevier
The growth kinetics of intermetallic (IMC) compound layers formed between Sn-3.5 Ag
solders and Cu substrate in soldering process are investigated experimentally and …
solders and Cu substrate in soldering process are investigated experimentally and …
Interfacial reaction and mechanical properties of Sn-Bi solder joints
F Wang, Y Huang, Z Zhang, C Yan - Materials, 2017 - mdpi.com
Sn-Bi solder with different Bi content can realize a low-to-medium-to-high soldering process.
To obtain the effect of Bi content in Sn-Bi solder on the microstructure of solder, interfacial …
To obtain the effect of Bi content in Sn-Bi solder on the microstructure of solder, interfacial …
Intermetallic compounds growth between Sn–3.5 Ag lead-free solder and Cu substrate by dipping method
DQ Yu, CML Wu, CMT Law, L Wang, JKL Lai - Journal of Alloys and …, 2005 - Elsevier
The formation and growth of intermetallic compound (IMC) layer at the interface between Sn–
3.5 Ag lead-free solder and the Cu substrate during soldering and aging were studied. The …
3.5 Ag lead-free solder and the Cu substrate during soldering and aging were studied. The …
Contact angle measurements of Sn-Ag and Sn-Cu lead-free solders on copper substrates
MF Arenas, VL Acoff - Journal of Electronic Materials, 2004 - Springer
In this study, the contact angles of four lead-free solders, namely, Sn-3.5 Ag, Sn-3.5 Ag-4.8
Bi, Sn-3.8 Ag-0.7 Cu, and Sn-0.7 Cu (wt.%), were measured on copper substrates at …
Bi, Sn-3.8 Ag-0.7 Cu, and Sn-0.7 Cu (wt.%), were measured on copper substrates at …
Reliability studies of Cu/Al joints brazed with Zn–Al–Ce filler metals
J Feng, X Songbai, D Wei - Materials & Design, 2012 - Elsevier
This paper examines the effect of different Ce content on the properties and microstructures
of Zn–22Al filler metals and Cu/Al brazing joints. The results indicate that, the spreading …
of Zn–22Al filler metals and Cu/Al brazing joints. The results indicate that, the spreading …
Effect of Bi addition on the activation energy for the growth of Cu5Zn8 intermetallic in the Sn–Zn lead-free solder
R Mayappan, ZA Ahmad - Intermetallics, 2010 - Elsevier
The growth kinetics of Cu5Zn8 phase has been investigated under long-term thermal
exposure conditions using single shear lap joints. The Cu5Zn8 phase was formed by …
exposure conditions using single shear lap joints. The Cu5Zn8 phase was formed by …