Scanning acoustic microscopy (SAM) system is a powerful nondestructive instrument owing
to its capability to provide internal information and defect positions inside a material. In …

Currently, the integration method of silicon PIN radiation detectors faces challenges such as
complex processes, poor reliability and thick dead layers. Novel integration methods based …

Advanced packaging aims to integrate multiple heterogeneous chiplets/dielets at fine (≤ 10
μm) bonding pitches, irrespective of their size, material and function. Metal-to-metal thermal …

In this study, two-step argon/nitrogen plasma-activated aluminum surface for aluminum-
aluminum direct bonding is reported. Surfaces from the as-deposited and the argon/nitrogen …

This paper proposes an innovative application of double slider-crank mechanism, which is
utilized to develop a fast scanning module (FSM) of the scanning acoustic microscopy (SAM) …

The main challenges for Al-Al wafer bonding are the fast oxidation and the high roughness
of the Al surface. This paper describes an optimized Al sputter-deposition process reducing …

Metallic alloy bonding uses an intermediate metal layer to join two or more stacked
components. The technology of metal seal bonding primarily comprises solder and eutectic …

Low-loss passive components for RF signals compatible with the on-wafer process are
essential for realizing integrated circuits with high-frequency and highpower operations. We …

This paper reviews advances in die/dielet-to-dielet (D2D), dielet-to-wafer (D2W) and dielet-
to-substrate integration for advanced packaging. Key D2D and D2W integration approaches …

In this work, we demonstrate an Al-Al direct bonding process for advanced wafer-level
packaging and heterogeneous integration. The wafer bonding process is performed at 300° …