CMOS-integrated aluminum nitride MEMS: A review

RMR Pinto, V Gund, RA Dias… - Journal of …, 2022 - ieeexplore.ieee.org
Aluminum nitride (AlN) has gained wide interest owing to its high values of elastic modulus,
band gap, dielectric strength, resistivity, thermal conductivity and acoustic velocities …

Advances in HbA1c biosensor development based on field effect transistors: a review

A Ahmadi, S Kabiri, K Omidfar - IEEE Sensors Journal, 2020 - ieeexplore.ieee.org
Diabetes mellitus is a lifelong disease and the 7th leading cause of death worldwide.
Hyperglycemia is the major hallmark of this disease that causes many clinical complications …

Multi-coefficient eigenmode operation—breaking through 10°/h open-loop bias instability in wideband aluminum nitride piezoelectric BAW gyroscopes

Z Liu, H Wen, F Ayazi - Microsystems & Nanoengineering, 2023 - nature.com
In this paper, a modification to the eigenmode operation of resonant gyroscopes is
introduced. The multi-coefficient eigenmode operation can improve cross-mode isolation …

A Drosophila-inspired intelligent olfactory biomimetic sensing system for gas recognition in complex environments

X Yue, J Wang, H Yang, Z Li, F Zhao, W Liu… - Microsystems & …, 2024 - nature.com
The olfactory sensory system of Drosophila has several advantages, including low power
consumption, high rapidity and high accuracy. Here, we present a biomimetic intelligent …

Micro Electro-Mechanical Systems (MEMS)

Y He, A Yu, X Liu, Y Wang - Handbook of Integrated Circuit Industry, 2023 - Springer
Typical process technologies for MEMS device manufacturing include wet etching, dry
etching, sacrificial layer technology, bonding, and SOI with cavity. Wet and dry etching …

3D integration of CMOS and MEMS using mechanically flexible interconnects (MFI) and through silicon vias (TSV)

HS Yang, MS Bakir - 2010 Proceedings 60th Electronic …, 2010 - ieeexplore.ieee.org
A 3D integration scheme for integrating a state-of-the-art CMOS IC with an arbitrary
MEMS/sensor chip is reported. The integration scheme consists of a CMOS IC and a MEMS …

Elliptic diaphragm capacitive pressure sensor and signal conditioning circuit fabricated in SiGe CMOS integrated MEMS

AD Sundararajan, SMR Hasan - IEEE Sensors Journal, 2014 - ieeexplore.ieee.org
This paper presents a novel CMOS integrated capacitive pressure sensor, fabricated in
silicon-germanium microelectromechanical systems (SiGeMEMS) process, with the sensor …

Distributed intelligent MEMS: progresses and perspectives

J Bourgeois, SC Goldstein - IEEE Systems Journal, 2013 - ieeexplore.ieee.org
Microelectromechanical systems (MEMS) research has, until recently, focused mainly on the
engineering process, resulting in interesting products and a growing market. To fully realize …

Distributed intelligent mems: Progresses and perspectives

J Bourgeois, SC Goldstein - International Conference on ICT Innovations, 2011 - Springer
MEMS research has until recently focused mainly on the engineering process, resulting in
interesting products and a growing market. To fully realize the promise of MEMS, the next …

Design, fabrication, and characterization of freestanding mechanically flexible interconnects using curved sacrificial layer

HS Yang, MS Bakir - IEEE Transactions on Components …, 2012 - ieeexplore.ieee.org
Technologies that enable integration of microelectromechanical systems (MEMS)(and
sensor) chip with a complementary metal-oxide semiconductor (CMOS) integrated circuit …