Warpage Modeling and Characterization of the Cure-dependent Chemical Shrinkage and Viscoelastic...

Simulation methodology development of warpage estimation for epoxy molding compound under considerations of stress relaxation characteristics and curing …

CC Lee, CC Lee, CP Chang - Materials Science in Semiconductor …, 2022 - Elsevier
The thermal mismatch between different components has been a serious issue in the
reliability of electronic products. The effect of epoxy molding compound (EMC) on the …
被引用次数：21 相关文章

Package Warpage Modeling by Considering Shrinkage Behavior of EMC and Substrate

W Yu, PSY Yang, C Glancey, YC Ong… - 2021 IEEE 23rd …, 2021 - ieeexplore.ieee.org
This paper demonstrates a novel finite element modeling (FEM) approach by considering
shrinkage behavior in Epoxy Molding Compound (EMC) and substrate material during …
被引用次数：2 相关文章

Research on Optimized Modeling of Package Warping Phenomenon

L Wu, T Pan, G Zhu, X Sun, X Zhang… - 2023 24th …, 2023 - ieeexplore.ieee.org
The further ultra-thin packaging structure has made packaging warpage a major technical
problem, which restricts the improvement of packaging yield. In response to this issue, this …
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Anisotropy of curing residual stress of underfill in the encapsulation under three-dimensionally constrained condition based on in-situ characterization

T Peng, X Peng, W Wu, L Peng, G Li… - 2022 IEEE 72nd …, 2022 - ieeexplore.ieee.org
To improve the reliability of microelectronic packages, underfills are widely used in flip-chip
packages to protect solder bumps from hazard environment. Nevertheless, the residual …
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