The recent advances and trends in heterogeneous integrations are presented in this study.
Emphasis is placed on:(A) the definition of heterogeneous integrations,(B) the classifications …

In this investigation, the chip-last, redistribution-layer (RDL)–first, fan-out panel-level
packaging (FOPLP) for heterogeneous integration is studied. Emphasis is placed on the …

This paper presents a novel 3D folded capacitive synaptic crossbar array designed for in-
memory computing architectures. In this architecture, the bitline is folded over the wordline to …

Abstract Multichip module (MCM), system-in-package (SiP), and heterogeneous integration
use packaging technology to integrate dissimilar chips, optical devices, and/or packaged …

The chiplet-based heterogeneous integration technology implemented on active interposers
has been developing rapidly in recent years. However, as the bit widths of interactive data …

Рассмотрены основные тенденции современного развития электронной компонентной
базы. Показаны основные проблемы, с которыми сталкиваются производители …

The scalability of the crossbar array is critical for performing complex computation tasks, as
large-scale synaptic arrays are required to complete the operations. To address the …

Abstract System-in-package (SiP) technology has been used extensively on consumer
products such as smartwatches, smartphones, tablets, notebooks, TWS (true wireless …

Ultra-high density 2.5/3D heterogeneous integration has been considered an essential
solution for rebooting computation applications like high performance computing, machine …

Рассмотрены основные тенденции современного развития электронной компонентной
базы. Показаны основные проблемы, с которыми сталкиваются производители …