One of the crucial factors in determining the reliability of an electronic device is fatigue
failure of the interconnecting solder joints. In most cases, large bulk samples are used to …

Pb-free solders based on Sn-Ag-Cu are currently applied to electronic devices. This article
investigates the thermomechanical reliability of three different compositions of Pb-free solder …

Additive manufacturing can realize almost any designed geometry, enabling the fabrication
of innovative products for advanced applications. Local electrochemical plating is a powerful …

The electronics industry is increasingly prioritizing the reliability of SnAgCu (SAC)-based
alloys due to environmental concerns related to lead-based alloys. Considering the frequent …

Fatigue failure of interconnected solder joints is a critical consideration for the reliability of an
electronic product. Commonly, fatigue properties of solder materials are investigated using …

Failure due to thermal cycling is common at the solder joint level of electronic assemblies
due to the mismatch in the coefficient of thermal expansions between the carrier and printed …

In harsh applications, the electronic systems' reliability relies on the mechanical integrity of
hundreds of solder interconnection against various triggers. The reliability is threatened by …

There have been several new solder alloys developed for high reliability applications. As
with any new product, the reliability has been the primary concern even in the case of new …

In this experiment, the thermal shock performance of various doped Pb-free solder pastes on
Ball Grid Array (BGA) packages and resistors were observed in order to determine their …

There has been a strong drive to remove Lead from electronics since the early 2000s.
Solder alloys based on tin (Sn), copper (Cu) and silver (Ag) were regarded as promising …