The presence of solder flux residues on the printed circuit board assembly surface is an
important factor contributing to humidity-related reliability issues that affect device lifetime …

The ionic residues of activator compounds used in the no-clean solder flux systems often
remain on a Printed Circuit Board Assembly surface after the soldering process and may …

The use of no-clean flux technology for the wave soldering process of a printed circuit board
assembly (PCBA) influences the humidity-related robustness of the electronic devices due to …

Water is ubiquitous in the environment and is present to varying degrees even within dry
powder products and most ingredients. Water migration between the environment and a …

The widespread use of no-clean solder flux technology compromises the corrosion reliability
of electronics exposed to humid conditions, and can lead to degradation of the device's …

At the “cold-end” of biomass and coal-fired plants, with decreasing temperature and
increasing relative humidity (RH) of the flue gas, moisture absorption by the hygroscopic …

This chapter contributes a review of the underlying factors by which water associates with
solids when the solid is exposed to water vapor and the resulting effects on the properties of …