TFT mask ROM and method for making same

AJ Walker, C Petti - US Patent 6,841,813, 2005 - Google Patents
US6841813B2 - TFT mask ROM and method for making same - Google Patents US6841813B2 -
TFT mask ROM and method for making same - Google Patents TFT mask ROM and method for …

Dense arrays and charge storage devices, and methods for making same

T Lee, V Subramanian, J Cleeves, A Walker… - US Patent App. 09 …, 2002 - Google Patents
2001-10-16 Assigned to MATRIX SEMICONDUCTOR, INC. reassignment MATRIX
SEMICONDUCTOR, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT …

Stackable integrated circuit packaging

D Mallik, K Ichikawa, TL Sterrett, J Swan - US Patent 7,345,361, 2008 - Google Patents
A system may include an integrated circuit die, an integrated circuit package coupled to the
integrated circuit die, mold compound in contact with the integrated circuit die and the …

Nonvolatile memory on SOI and compound semiconductor substrates and method of fabrication

AJ Walker, MG Johnson, NJ Knall… - US Patent …, 2005 - Google Patents
(57) ABSTRACT A nonvolatile memory array is provided. The array includes an array of
nonvolatile memory devices, at least one driver circuit, and a Substrate. The at least one …

Monolithic three dimensional array of charge storage devices containing a planarized surface

TH Lee, V Subramanian, JM Cleeves… - US Patent …, 2005 - Google Patents
US6881994B2 - Monolithic three dimensional array of charge storage devices containing a
planarized surface - Google Patents US6881994B2 - Monolithic three dimensional array of …

Vertically-stacked, field-programmable, nonvolatile memory and method of fabrication

MG Johnson - US Patent 6,525,953, 2003 - Google Patents
(57) ABSTRACT A three-dimensional,? eld-programmable, non-volatile memory includes
multiple layers of? rst and second crossing conductors. Pillars are self-aligned at the …

Semiconductor package and method for fabricating the same

WS Shin, DS Chun, S Lee, SG Lee… - US Patent …, 2002 - Google Patents
Semiconductor packages having a thin structure capable of easily discharging heat from a
semiconductor chip included therein, and methods for fabricating such semiconductor …

Stacked microelectronic assembly and method therefor

V Solberg - US Patent 6,121,676, 2000 - Google Patents
A method of making a stacked microelectronic assembly such as a semiconductor chip
assembly and its resulting structure includes providing a flexible substrate having a plurality …

Stacked microelectronic assembly and method therefor

Y Kim, B Haba, V Solberg - US Patent 6,699,730, 2004 - Google Patents
A method of making a stacked microelectronic assembly includes providing a flexible
substrate having a plurality of attachment sites, test contacts and conductive terminals, and …

Stacked chip assembly

PH Bellaar - US Patent 5,861,666, 1999 - Google Patents
The foregoing invention addresses these needs. One aspect of the present invention
provides a multiple Semiconductor chip assembly. Preferred assemblies in accordance with …