Analytical random vibration analysis of boundary-excited thin rectangular plates
AH Hosseinloo, FF Yap, N Vahdati - International Journal of …, 2013 - World Scientific
Fatigue life, stability and performance of majority of the structures and systems depend
significantly on dynamic loadings applied on them. In many engineering cases, the dynamic …
significantly on dynamic loadings applied on them. In many engineering cases, the dynamic …
Fatigue Life Based Study of Electronic Package Mounting Locations on Printed Circuit Boards Subjected to Random Vibration Loads
N Muthuram, S Saravanan - Journal of Electronic Testing, 2024 - Springer
Abstract Plastic Ball Grid Array (PBGA) packages (chips) mounted on a Printed Circuit Board
(PCB) assembly are vulnerable and are more likely to fail when they are subjected to …
(PCB) assembly are vulnerable and are more likely to fail when they are subjected to …
Microelectromechanical systems device test system and method
P Garre, S Garre - US Patent 10,288,447, 2019 - Google Patents
A system includes a rotary platform adapted to undergo oscillatory motion about a fixed
point, a test fixture coupled to the rotary platform, the test fixture being adapted to receive a …
point, a test fixture coupled to the rotary platform, the test fixture being adapted to receive a …
Process Development, Thermal Characterization and Reliability Study of a Differential DIMM Using a DDP DRAM Package
S Patra - 2022 - search.proquest.com
Electronics packaging has advanced significantly over the last few decades, primarily in
response to customer demand and changes in the functionality of systems that comprise of …
response to customer demand and changes in the functionality of systems that comprise of …
Assembly Process and Reliability Evaluation for High Density Step Assembly
GH Phadke - 2018 - search.proquest.com
The past four decades have witnessed significant developments in the electronics
packaging industry. The need for lower cost and advanced functionality in terms of faster …
packaging industry. The need for lower cost and advanced functionality in terms of faster …
히트싱크적용에따른BGA 패키지의발사진동및궤도열환경조건에서의피로수명의해석적검토
박태용， 권성철， 박종찬， 오현웅 - 한국소음진동공학회논문집, 2017 - dbpia.co.kr
For thermal control of electronic equipment for space applications under extreme on-orbit
thermal environment, heat sink is applied for component with excessive heat dissipation. In …
thermal environment, heat sink is applied for component with excessive heat dissipation. In …
[PDF][PDF] Dynamic analysis of HSDB System and evaluation of Boundary Non-linearity through experiments
K Chandrakar, PLV Rao, P Rajendran… - Defence Science …, 2016 - core.ac.uk
High speed digital board (HSDB) is used to perform accurate parameter measurement,
classification, identification and determination of technical parameters of different type of …
classification, identification and determination of technical parameters of different type of …
[图书][B] Design of DC-Link Capacitor of High Power Switch Module of an Aircraft Power & Thermal Management Controller
MA Rahman - 2015 - search.proquest.com
DC-Link Capacitor used in power converters as an energy buffer is one of the key
components of aircraft Power and Thermal Management Controller (PTMC). Several factors …
components of aircraft Power and Thermal Management Controller (PTMC). Several factors …
[PDF][PDF] Academic background
B Com, M Com - Management, 1969 - hansrajcollege.ac.in
Ruchi Page 1 Ruchi Female, 37 years ruchi@hrc.du.ac.in Contact: 9910214003 (M) ACADEMIC
BACKGROUND Course Year University/Board Institute Ph.D. (Roll no_19/24) 2019- Pursuing …
BACKGROUND Course Year University/Board Institute Ph.D. (Roll no_19/24) 2019- Pursuing …