Various embodiments of fanout packages are disclosed. A method of forming a
microelectronic assembly is disclosed. The method can include bonding a first surface of at …

(57) ABSTRACT A microelectronic unit includes a microelectronic element, eg, an integrated
circuit chip, having a semiconductor region of monocrystalline form. The semiconductor …

An image sensor device, as well as methods therefor, is disclosed. This image sensor
device includes a substrate having bond pads. The substrate has a through substrate …

Apparatuses and methods are described. This apparatus includes a bridge die having first
contacts on a die surface being in a molding layer of a reconstituted wafer. The reconstituted …

A microelectronic unit can include a substrate having front and rear surfaces and active
semiconductor devices therein, the substrate having a plurality of openings arranged in a …

Methods of forming a back side image sensor device, as well as back side image sensor
devices formed, are disclosed. In one such a method, an image sensor wafer having a first …

(57) ABSTRACT A microelectronic assembly can include a Substrate having first and
second Surfaces, at least two logic chips overlying the first surface, and a memory chip …

The present invention relates to packaging of microelec tronic devices and interposer
structures, especially conduc tive via structures and methods of forming Such via structures …

2010-11-08 Assigned to TESSERA RESEARCH LLC reassignment TESSERA RESEARCH
LLC ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS) …

H04L9/32—Cryptographic mechanisms or cryptographic arrangements for secret or secure
communications; Network security protocols including means for verifying the identity or …