Fatigue failure of solder joints is one of the major causes of failure in electronic devices.
Fatigue life prediction models of solder joints were first put forward in the early 1960s, and …

The surface finish (SF) becomes a part of the solder joint during assembly and improves the
component's reliability. Furthermore, the SF influences the solder joint's reliability by …

Abstract The reliability of Sn-Ag-Cu (SAC)-based solder alloys has been extensively
investigated after the prohibition of lead in the electronics industry owing to their toxicity. Low …

Since the restriction of hazardous substances (RoHS) directive, lead-free soldering has
been widely broad adopted. In many applications, lead-free alloys have been substituted for …

One of the crucial factors in determining the reliability of an electronic device is fatigue
failure of the interconnecting solder joints. In most cases, large bulk samples are used to …

Solder joints reliability is a determinant factor for the life of the electronic assemblies. In this
study, the reliability of actual SAC305 solder joints is investigated using accelerated shear …

The reliability of SnAgCu (SAC)-based alloys has attracted considerable attention following
the restrictions on lead-based alloys in the electronics industry due to their toxic nature …

Reliability of microelectronic assemblies is typically limited by the fatigue failure of one of the
interconnected solder joints. The fatigue behavior of the lead-free solder joints doped with …

In realistic applications, the solder joint is continually subjected to thermal-mechanical stress
due to the difference in the coefficient of thermal expansion (CTE) between the printed circuit …

Solder joints in electronic assemblies are subjected to mechanical cycling in normal
operating conditions. Testing individual solder joint in mechanical cycling allows monitoring …