US8021976B2 - Method of wire bonding over active area of a semiconductor circuit -
Google Patents US8021976B2 - Method of wire bonding over active area of a …

A system for batch forming a sheet of spring elements in three dimensions is described. A
spring element sheet containing spring elements defined in two dimensions is arranged …

An elastic contact array circuitized substrate includes a circuitized substrate provided with
circuit traces, and an array of three dimensional contact elements joined to the circuitized …

An electrical connector for electrically connecting to pads of a land grid array formed on an
electronic component includes a dielectric layer including opposing first and second …

(57) ABSTRACT A system for batch forming a sheet of spring elements in three dimensions
includes a top spacer layer. A plurality of ball bearings is arranged in a predetermined …

A method for fabricating an electrical connector made up of an array of metallic contacts that
act as conductive carriers, each attached to a flexible insulating sheet in one of an array of …

The package includes a Substrate, a first chip, a second chip, multiple first bumps and
multiple second bumps. The sub strate has a first region and a second region. The first …

N the filled vias includes the steps of plating the vias with an electrically-conductive material
to create an electrically-con ductive path between portions of the substrate and compo nents …

H01L 29/40(200601) A olrcult structure 1ncludes a semlconductor substrate,? rst H01L
23/532(200601) and second metallic posts over the semiconductor substrate, H01L …

Disclosed is an electrical connector having a Substrate and movable electrical contacts
which are mounted to the sub strate and extend a distance D from the substrate. A layer of …