The development of modern electronics and equipment, especially those with high power
density, has long relied on rapid heat dissipation of integrated chips, yet a challenge to date …

The continuous trend of miniaturization leads to unprecedented power densities within
electronic devices, which also becomes the bottleneck of the device performance. Effective …

The densification of integrated circuits requires thermal management strategies and high
thermal conductivity materials,–. Recent innovations include the development of materials …

Thermal management is the most critical technology challenge for modern electronics.
Recent key materials innovation focuses on developing advanced thermal interface of …

Controlling heat flow is a key challenge for applications ranging from thermal management
in electronics to energy systems, industrial processing, and thermal therapy. However …

Thermal management is critical in modern electronic systems. Efforts to improve heat
dissipation have led to the exploration of novel semiconductor materials with high thermal …

With the increased level of integration and miniaturization of modern electronics, high-power
density electronics require efficient heat dissipation per unit area. To improve the heat …

Most polymers possess low thermal conductivity and are therefore limited in thermal
management applications. A key solution is to develop highly thermally conductive polymer …

Highlights•A stable and sustainable solar steam generator based on cellulose aerogel was
prepared.•To recycle textile waste and reuse them in solar steam generation.•The …

Over the past few decades, significant progress has been made in micro-and nanoscale
heat transfer. Numerous computational methods have been developed to quantitatively …