A thermal path is formed in a layer transferred semiconductor structure. The layer transferred
semiconductor structure has a semiconductor wafer and a handle wafer bonded to a top …

Embodiments of the present disclosure describe a multi-layer package with antenna and
associated techniques and configurations. In one embodiment, an integrated circuit (IC) …

BACKGROUND Semiconductor devices are continually designed to be Smaller, more
complex and/or packaged more densely to thereby facilitate modern electronic devices that …

The present disclosure provides a semiconductor package device and a method for
manufacturing the same. In embodi ments of the present disclosure, a semiconductor …

A device and method of forming the device that includes cavities formed in a substrate of a
substrate device, the substrate device also including conductive vias formed in the substrate …

(57) ABSTRACT RF transmission device including at least: a Substrate comprising first and
second faces opposite to each other; a first RF transmission electronic circuit arranged on …

US9679839B2 - Chip on package structure and method - Google Patents US9679839B2 - Chip
on package structure and method - Google Patents Chip on package structure and method …

The disclosure relates to a glass-based antenna array package. In an aspect, such a glass-
based antenna array package includes a single glass substrate layer, one or more antennas …

BACKGROUND Fan-Out Wafer Level Packaging (FO-WLP) processes are well-known within
the semiconductor industry for producing microelectronic packages having peripheral fan …

G06F1/1698—Constructional details or arrangements related to integrated I/O peripherals
not covered by groups G06F1/1635-G06F1/1675 the I/O peripheral being a …