Techniques for integrating two-phase cooling into a micro processor chip package lid are
provided. In one aspect, a vapor chamber lid device includes: an evaporator plate; a …

An electronic device according to an embodiment of the present disclosure includes a
printed circuit board (PCB), a first component disposed in a first region on the PCB and a …

An apparatus for managing heat generated by at least one electronic component of a mobile
device, the apparatus com prising: a housing for containing the electronic component of the …

An electronic component includes one or more semiconduc tor dice embedded in a first
dielectric layer, means for a spreading heat in directions substantially parallel to a major …

An apparatus for cooling an electronic device is disclosed. In an aspect, the apparatus
includes a vapor chamber coupled to a heat generating component of the electronic device …

(57) ABSTRACT A thermal conductive device includes a first conductive plate, a second
conductive plate, a plurality of wicks and a fluid. The first conductive plate has a first portion …

In various embodiments, a package may be provided. The package may include a chip
carrier. The package may further include a chip arranged over the chip carrier. The package …

Primary Examiner—Phuc T Dang (74) Attorney, Agent, or Firm-Qualcomm Incorporated (57)
ABSTRACT Aspects of the disclosure are directed to a package including a substrate, die …

SUMMARY OF THE INVENTION 0007 Embodiments of the present invention set forth a
microelectronic package a package Substrate with at least one semiconductor die mounted …

The present invention provides a structure of uniform-temperature heat dissipation device. A
thermal plate is disposed on a heat-emitting device on a substrate correspondingly. A …