Recent advances in multi-material 3D printing of functional ceramic devices

H Chen, L Guo, W Zhu, C Li - Polymers, 2022 - mdpi.com
In recent years, functional ceramic devices have become smaller, thinner, more refined, and
highly integrated, which makes it difficult to realize their rapid prototyping and low-cost …

Additively manufactured RF components and modules: Toward empowering the birth of cost-efficient dense and ubiquitous IoT implementations

SA Nauroze, JG Hester, BK Tehrani, W Su… - Proceedings of the …, 2017 - ieeexplore.ieee.org
In this review, the particular importance and associated opportunities of additively
manufactured radiofrequency (RF) components and modules for Internet of Things (IoT) and …

A printed millimetre-wave modulator and antenna array for backscatter communications at gigabit data rates

J Kimionis, A Georgiadis, SN Daskalakis… - Nature …, 2021 - nature.com
Future devices for the Internet of Things will require communication systems that can deliver
higher data rates at low power. Backscatter radio—in which wireless communication is …

[PDF][PDF] Creativity in packaging design as a competitive promotional tool

D Elkhattat, M Medhat - Information Sciences Letters, 2022 - digitalcommons.aaru.edu.jo
In line with the vast technology, and challenging competition among organizations in the
field of industry, recently the food companies recognized the importance of innovative …

Hybrid (3D and inkjet) printed electromagnetic pressure sensor using metamaterial absorber

H Jeong, Y Cui, MM Tentzeris, S Lim - Additive Manufacturing, 2020 - Elsevier
This paper proposed a hybrid printed electromagnetic pressure sensor using a metamaterial
absorber. We used a three-dimensional printed flexible resin for the transformable substrate …

Additively manufactured mm-wave multichip modules with fully printed “smart” encapsulation structures

X He, BK Tehrani, R Bahr, W Su… - IEEE Transactions on …, 2019 - ieeexplore.ieee.org
This article presents the first time that an millimeter-wave (mm-wave) multichip module
(MCM) with on-demand “smart” encapsulation has been fabricated utilizing additive …

Exploring 3-D printing for new applications: Novel inkjet-and 3-D-printed millimeter-wave components, interconnects, and systems

R Bahr, B Tehrani, MM Tentzeris - IEEE Microwave magazine, 2017 - ieeexplore.ieee.org
This article outlines a number of inkjet-/threedimensional (3-D)-printed prototypes of RF and
millimeter-wave (mmW) components, interconnects, and systems. We pay special attention …

Inkjet-printed and electroplated 3D electrodes for recording extracellular signals in cell culture

L Grob, P Rinklin, S Zips, D Mayer, S Weidlich… - Sensors, 2021 - mdpi.com
Recent investigations into cardiac or nervous tissues call for systems that are able to
electrically record in 3D as opposed to 2D. Typically, challenging microfabrication steps are …

E-band characterization of 3D-printed dielectrics for fully-printed millimeter-wave wireless system packaging

BK Tehrani, RA Bahr, W Su, BS Cook… - 2017 IEEE MTT-S …, 2017 - ieeexplore.ieee.org
This work explores the integration of 3D and inkjet printing manufacturing processes with
millimeter-wave (mm-wave) wireless packaging technology. Stereolithography-based (SLA) …

Flexible chip-first millimeter-wave packaging using multiple dielectrics

X Konstantinou, JD Albrecht, P Chahal… - IEEE Transactions …, 2022 - ieeexplore.ieee.org
This article focuses on improving the robustness of fully additive manufactured packaging
solutions for application-specific, millimeter-wave (mm-wave) system integration. We …