[HTML][HTML] Computer simulation of Cu: AlOOH/water in a microchannel heat sink using a porous media technique and solved by numerical analysis AGM and FEM

SA Abdollahi, P Jalili, B Jalili, H Nourozpour… - Theoretical and Applied …, 2023 - Elsevier
Extensive improvements in small-scale thermal systems in electronic circuits, automotive
industries, and microcomputers conduct the study of microsystems as essential. Flow and …

Design and optimization of heat sinks for the liquid cooling of electronics with multiple heat sources: a literature review

Y Li, S Roux, C Castelain, Y Fan, L Luo - Energies, 2023 - mdpi.com
This paper presents a detailed literature review on the thermal management issue faced by
electronic devices, particularly concerning uneven heating and overheating problems …

Characterization of MEMS heat sinks having straight microchannels integrating square pin-fins for liquid cooling of microelectronic chips

A Alkhazaleh, F Alnaimat, B Mathew - Thermal Science and Engineering …, 2023 - Elsevier
This work presents a liquid based MEMS (microelectromechanical systems) heat sink
having straight microchannel integrating square pin-fins for cooling of microelectronic chips …

Comprehensive review of enhancement techniques and mechanisms for flow boiling in micro/mini-channels

H Shang, G Xia, L Cheng, S Miao - Applied Thermal Engineering, 2024 - Elsevier
Due to the urgent need for heat dissipation of high heat flux devices in many engineering
applications to maintain high performance and stable operation, flow boiling in micro/mini …

Backward-facing step heat transfer enhancement: a systematic study using porous baffles with different shapes and locations and corrugating after step wall

H Talaei, HR Bahrami - Heat and Mass Transfer, 2023 - Springer
This study investigates methods to improve heat transfer in electronic devices through forced
convective cooling. Adequate energy dissipation from tiny elements on electronic boards is …

Enhanced heat transfer in a microchannel with pseudo-roughness induced by Onsager-Wien effect

RD Selvakumar, D Kong, HK Lee… - Applied Thermal …, 2023 - Elsevier
A three-dimensional numerical analysis of flow and conjugate heat transfer in a
microchannel in the presence of the electric-field-induced Onsager–Wien effect is …

[HTML][HTML] Oblique microchannel merged with circle micro pin-fin as a novel hybrid heat sink for cooling of electronic devices

Y Alihosseini, Y Oghabneshin, AR Bari… - Case Studies in Thermal …, 2024 - Elsevier
Recently, the advantages of microchannel and micro pin-fin heat sinks for cooling have
become clear. This study delves into the effects of hybrid designs on electronic chip cooling …

[HTML][HTML] Fluid flow and heat transfer behavior of a liquid based MEMS heat sink having wavy microchannels integrating circular pin-fins

A Alkhazaleh, F Alnaimat, B Mathew - International Journal of Thermofluids, 2023 - Elsevier
MEMS heat sink having wavy microchannels integrating circular pin-fins for cooling of
microelectronic chips is proposed and analyzed in this work; the pin-fins are placed at the …

[HTML][HTML] Novel approach to cooling microelectronics with complex fins configuration

NY Godi - International Journal of Thermofluids, 2024 - Elsevier
This paper presents a numerical simulation and optimisation of a complex microchannel
featuring innovative fin designs. The primary objective of the study is to minimise resistance …

Comprehensive review and future prospects on chip-scale thermal management: Core of data center's thermal management

Z Li, H Luo, Y Jiang, H Liu, L Xu, K Cao, H Wu… - Applied Thermal …, 2024 - Elsevier
Data centers are increasingly important for global societal and economic advancement. The
reliable operation of data centers depends on robust thermal management systems for …