Stress/strain characterization in electronic packaging by micro-Raman spectroscopy: A review

L Ma, W Qiu, X Fan - Microelectronics Reliability, 2021 - Elsevier
In this review, a review a of the applications of micro-Raman spectroscopy (μRS) to
characterize the residual strain and/or stress in electronic packaging is presented. Micro …

[图书][B] Metrology and Diagnostic Techniques for Nanoelectronics

Z Ma, DG Seiler - 2017 - taylorfrancis.com
Nanoelectronics is changing the way the world communicates, and is transforming our daily
lives. Continuing Moore's law and miniaturization of low-power semiconductor chips with …

Determination of stress components in 4H-SiC power devices via Raman spectroscopy

R Sugie, T Uchida - Journal of Applied Physics, 2017 - pubs.aip.org
The stress dependencies of the phonon modes in a 4H silicon carbide (SiC) crystal were
investigated. The deformation potentials of the A 1 (TO), E 2, and E 1 (TO) modes were …

Relation between Raman frequency and triaxial stress in Si for surface and cross-sectional experiments in microelectronics components

I De Wolf - Journal of Applied Physics, 2015 - pubs.aip.org
This paper provides a detailed description explaining how to calculate the relation between
the silicon Raman frequency and local stress or strain in the silicon, applied to stress …

Thermal analysis and operational characteristics of an AlGaN/GaN High electron mobility transistor with copper-filled structures: A simulation study

KW Jang, IT Hwang, HJ Kim, SH Lee, JW Lim, HS Kim - Micromachines, 2019 - mdpi.com
In this study, we investigated the operational characteristics of AlGaN/GaN high electron
mobility transistors (HEMTs) by applying the copper-filled trench and via structures for …

Development of a method to evaluate the stress distribution in 4H-SiC power devices

H Sakakima, S Takamoto, Y Murakami… - Japanese Journal of …, 2018 - iopscience.iop.org
We detected all components of the deformation potential constants of 4H-SiC by first-
principles calculations and developed a method to estimate the stress distribution in 4H-SiC …

Biaxial stress evaluation in GeSn film epitaxially grown on Ge substrate by oil-immersion Raman spectroscopy

K Takeuchi, K Suda, R Yokogawa… - Japanese Journal of …, 2016 - iopscience.iop.org
GeSn is being paid much attention as a next-generation channel material. In this work, we
performed the excitation of forbidden transverse optical (TO) phonons from strained GeSn …

Three-dimensional micro-Raman spectroscopy mapping of stress induced in Si by Cu-filled through-Si vias

D Kosemura, I De Wolf - Applied Physics Letters, 2015 - pubs.aip.org
Three-dimensional (3D) micro-Raman spectroscopy mapping of mechanical stress induced
by Cu through-Si vias (TSVs) in the Si substrate is reported. The 3D-map is obtained by …

Examination of phonon deformation potentials for accurate strain measurements in silicon–germanium alloys with the whole composition range by Raman …

D Kosemura, S Yamamoto, K Takeuchi… - Japanese Journal of …, 2016 - iopscience.iop.org
The phonon deformation potentials (PDPs), p and q, of Si 1− x Ge x with the whole range of
the Ge concentration x were examined in detail in pursuit of accurate strain measurements …

Thermal stress analysis in die-attached β-Ga2O3 using Raman spectroscopy

T Uchida, R Sugie - Japanese Journal of Applied Physics, 2023 - iopscience.iop.org
We determine the stress deformation potentials using micro-Raman spectroscopy and
evaluate thermal stress in a (− 201) plane β-Ga 2 O 3 mounted on a Cu plate with a Pb-free …