Miniaturization as well as manufacturing processes that electronics devices are subjected to
often results in to increase in operational parameters such as current density, temperature …

The advance of semiconductor technology not only enables integrated circuits with higher
density and better performance but also increases their vulnerability to various aging …

In this article, we present a novel approach to real-time tracking of full-chip heatmaps for
commercial off-the-shelf microprocessors based on machine-learning. The proposed post …

In this article, we present a novel post-silicon approach to locating the dominant heat
sources on commercial multicore processors using heatmaps measured via an infrared (IR) …

2.5 D chiplet-based technology promises an efficient integration technique for advanced
designs with more functionality and higher performance. Temperature and related thermal …

Power integrity analysis is an essential step in power distribution network (PDN) sign-off to
ensure the performance and reliability of chips. However, with the growing PDN size and …

In this article, we will present recent advances in VLSI reliability effects with a focus on
electromigration (EM) failure/aging effect on interconnects, which is one of the most …

Reservoirs, extensions at the cathode-end, are constructed to extend the lifetime of
integrated circuit (IC) lines in terms of electromigration (EM) damage. The threshold current …

The reservoir is an expansion at the cathode-end in the electric line, which improves the
lifetime for electromigration (EM). In contrast, the sink, an additional part at the anode-end …

In this work, a method to determine critical circuit blocks for electromigration in an integrated
circuit based on a temperature analysis of the metallization layers is developed. Considering …