Hardware trojans in 3-D ICs due to NBTI effects and countermeasure

SF Mossa, SR Hasan, O Elkeelany - Integration, 2017 - Elsevier
Going vertical as in 3-D IC design, reduces the distance between vertical active silicon dies,
allowing more dies to be placed closer to each other. However, putting 2-D IC into three …

Investigation of reliability and security issues in through silicon via based three-dimensional integrated circuits

SF Mossa - 2016 - search.proquest.com
With the advancement in modern integrated circuits the increment in global wire delays is
enormously higher compared to the gate delays. To extract and study the parasitic value of …