Structure and properties of Sn-Cu lead-free solders in electronics packaging
M Zhao, L Zhang, ZQ Liu, MY Xiong… - Science and technology …, 2019 - Taylor & Francis
With the development of lead-free solders in electronic packaging, Sn-Cu lead-free solder
has attracted wide attention due to its excellent comprehensive performance and low cost. In …
has attracted wide attention due to its excellent comprehensive performance and low cost. In …
Critical properties of Cu6Sn5 in electronic devices: Recent progress and a review
As the most common of the intermetallic compounds (IMCs) formed between Sn-based
solders and Cu substrates during the packaging of integrated circuits (ICs), Cu 6 Sn 5 is …
solders and Cu substrates during the packaging of integrated circuits (ICs), Cu 6 Sn 5 is …
Nickel-stabilized hexagonal (Cu, Ni) 6Sn5 in Sn–Cu–Ni lead-free solder alloys
K Nogita, T Nishimura - Scripta Materialia, 2008 - Elsevier
Cu6Sn5 is an important intermetallic compound (IMC) in lead-free solder alloys. Cu6Sn5
exists in two crystal structures with an allotropic transformation from monoclinic η′-Cu6Sn5 …
exists in two crystal structures with an allotropic transformation from monoclinic η′-Cu6Sn5 …
Stabilisation of Cu6Sn5 by Ni in Sn-0.7 Cu-0.05 Ni lead-free solder alloys
K Nogita - Intermetallics, 2010 - Elsevier
Cu6Sn5 exists at least in two crystal structures with an allotropic transformation from
monoclinic η'-Cu6Sn5 at temperatures lower than 186° C to hexagonal η-Cu6Sn5. We …
monoclinic η'-Cu6Sn5 at temperatures lower than 186° C to hexagonal η-Cu6Sn5. We …
The study of mechanical properties of Sn–Ag–Cu lead-free solders with different Ag contents and Ni doping under different strain rates and temperatures
In this paper, the tensile tests were conducted at 25° C to investigate the effect of Ag content
and Ni doping on the microstructures and mechanical properties of Sn–3.0 Ag–0.5 Cu, Sn …
and Ni doping on the microstructures and mechanical properties of Sn–3.0 Ag–0.5 Cu, Sn …
Cracking and phase stability in reaction layers between Sn-Cu-Ni solders and Cu substrates
K Nogita, CM Gourlay, T Nishimura - Jom, 2009 - Springer
A method of limiting cracking in the Cu 6 Sn 5 intermetallic compounds (IMCs) at the
interface between lead-free solders and copper substrates has been developed. To explore …
interface between lead-free solders and copper substrates has been developed. To explore …
[HTML][HTML] The effect of Bi on the microstructure, electrical, wettability and mechanical properties of Sn-0.7 Cu-0.05 Ni alloys for high strength soldering
This paper elucidated the effects of the Bi element (0 wt%, 0.5 wt% and 1.5 wt%) on the
microstructure, electrical, wettability and mechanical properties of the Sn-0.7 Cu-0.05 Ni as a …
microstructure, electrical, wettability and mechanical properties of the Sn-0.7 Cu-0.05 Ni as a …
Growth mechanism of intermetallic compound and mechanical properties of nickel (Ni) nanoparticle doped low melting temperature tin–bismuth (Sn–Bi) solder
AK Gain, L Zhang - Journal of Materials Science: Materials in Electronics, 2016 - Springer
This paper investigates the effects of Ni nanoparticles on the formation of intermetallic
compound (IMC) layers and mechanical properties of low melting temperature Sn–58Bi …
compound (IMC) layers and mechanical properties of low melting temperature Sn–58Bi …
[HTML][HTML] Electrodeposition of ternary Sn-Cu-Ni alloys as lead-free solders using deep eutectic solvents
The paper presents several experimental results regarding the electrodeposition of Sn-Cu-
Ni ternary alloys as an attractive lead-free solder candidate, involving deep eutectic solvents …
Ni ternary alloys as an attractive lead-free solder candidate, involving deep eutectic solvents …
Rapid Cu6Sn5 growth at liquid Sn/solid Cu interfaces
MAAM Salleh, SD McDonald, H Yasuda, A Sugiyama… - Scripta Materialia, 2015 - Elsevier
In situ observations of the reaction between solid Cu in contact with molten Sn–0.7 wt.% Cu
were achieved using a synchrotron X-ray imaging technique. It was found that, upon wetting …
were achieved using a synchrotron X-ray imaging technique. It was found that, upon wetting …