Laser printing of conformal and multi-level 3D interconnects
H Kim, M Duocastella, KM Charipar, RCY Auyeung… - Applied Physics A, 2013 - Springer
A crucial challenge in three-dimensional multi-chip assemblies is to establish electrical
connections between discrete devices. Here, we apply laser printing of congruent voxels of …
connections between discrete devices. Here, we apply laser printing of congruent voxels of …
High-performance compact 3-D solenoids for RF applications
A Cayron, C Viallon, O Bushueva… - IEEE Microwave and …, 2018 - ieeexplore.ieee.org
A cost-effective technology is proposed for the integration of very compact and high-
performance 3-D solenoid inductors. Based on a two metal level process, it involves a 3-D …
performance 3-D solenoid inductors. Based on a two metal level process, it involves a 3-D …
On-wafer measurement errors due to unwanted radiations on high-Q inductors
This paper investigates the disagreements that may occur between on-wafer measurements
and electromagnetic (EM) simulations of high-Q inductive devices. Such disagreements are …
and electromagnetic (EM) simulations of high-Q inductive devices. Such disagreements are …
Ultra-thin QFN-like 3D package with 3D integrated passive devices
A Ghannam, N van Haare, J Bravin… - 2019 IEEE 69th …, 2019 - ieeexplore.ieee.org
In this work, a new wafer-level 3D packaging technology is developed to enable integration
of an ultra-thin QFN-like (quad-flat no-leads) 3D package that targets both effective electrical …
of an ultra-thin QFN-like (quad-flat no-leads) 3D package that targets both effective electrical …
Fast cut-off, low I2T and high temperature monolithic on-chip fuse on silicon substrate for new fail-safe embedded power switch
A Oumaziz, E Sarraute, F Richardeau… - Microelectronics …, 2021 - Elsevier
In this paper, a first concept of monolithic semiconductor fuses on silicon substrate, is
realized and experimentally characterized. These new compact devices are, able to perform …
realized and experimentally characterized. These new compact devices are, able to perform …
Package Thickness Investigation of the U-Slot Patch Antenna for Beyond-5G Antenna-in-Package Applications
MMA Versluis, R Schulpen, RXF Budé… - … on Antennas and …, 2022 - ieeexplore.ieee.org
The U-slot patch antenna is explored as broadband antenna solution for a multi-layer
interconnect antenna-in-package (AiP) technology for beyond-5G and 6G phased array …
interconnect antenna-in-package (AiP) technology for beyond-5G and 6G phased array …
Conception, réalisation et caractérisation d'inductances et de transformateurs tridimensionnels pour applications RF et microondes
O Bushueva - 2016 - laas.hal.science
La miniaturisation, la fabrication et l'intégration des composants passifs RF constituent des
enjeux majeurs actuels, sans oublier le critère du coût de fabrication, très important …
enjeux majeurs actuels, sans oublier le critère du coût de fabrication, très important …
Solénoïdes 3D compacts pour applications RF
O Bushueva, A Ghannam, A Magnani… - 20èmes Journées …, 2017 - hal.science
Ce papier présente un procédé technologique faible coût dédié à l'intégration d'inductances
3D compactes et à hautes performances. Ce procédé s' appuie sur deux étapes de …
3D compactes et à hautes performances. Ce procédé s' appuie sur deux étapes de …
Pertes par rayonnement lors de la caractérisation sous pointes d'inductances à fort Q
Ce papier traite des écarts importants constatés entre les mesures et les simulations
électromagnétiques (EM) pour un solénoïde intégré de 3 nH, notamment une valeur du …
électromagnétiques (EM) pour un solénoïde intégré de 3 nH, notamment une valeur du …