Effects of varying the fin width, fin height, gate dielectric material, and gate length on the DC and RF performance of a 14-nm SOI FinFET structure

NEI Boukortt, TR Lenka, S Patanè, G Crupi - Electronics, 2021 - mdpi.com
The FinFET architecture has attracted growing attention over the last two decades since its
invention, owing to the good control of the gate electrode over the conductive channel …

FinFET to GAA MBCFET: A Review and Insights

RR Das, TR Rajalekshmi, A James - IEEE Access, 2024 - ieeexplore.ieee.org
This review article presents a journey from Fin-shaped field effect transistor (FinFET) to gate-
all-around multi-bridge channel field effect transistor (GAA MBCFET) technology, unraveling …

Effect of gamma irradiation on the physical properties of MoS 2 monolayer

CP Chavda, A Srivastava, E Vaughan… - Physical Chemistry …, 2023 - pubs.rsc.org
Two-dimensional transition metal dichalcogenides (2D-TMDs) have been proposed as
novel optoelectronic materials for space applications due to their relatively light weight …

Comparative performance of the ultra-short channel technology for the DG-FinFET characteristics using different high-k dielectric materials

N Bourahla, A Bourahla, B Hadri - Indian Journal of Physics, 2021 - Springer
The downscaling of the SOI-MOSFET device has an important role of the advanced
technology in the semiconductor industry, so the researchers aim to find the structure which …

Temperature-dependent threshold voltage extraction of FinFETs using noise measurements

Y Wu, X Chi, F Wang, X Liu, J Liu… - IEEE Transactions …, 2022 - ieeexplore.ieee.org
In this article, a temperature-dependent threshold voltage extraction method based on noise
measurement is proposed. This method induces a mathematical solution for acquiring …

Temperature investigation of a novel 3nm TF-Bulk FinFET for improved performance

MP Kashyap, R Chaujar - 2020 IEEE 20th International …, 2020 - ieeexplore.ieee.org
In this investigation, a novel Truncated Fin (TF) Junctionless (JL) bulk FinFET is compared
over it's conventional structure. This paper is the analysis of highperformance temperature …

Development of adhesive wafer bonding technology

MY Fomichev, MA Makhiboroda… - … IEEE Conference of …, 2021 - ieeexplore.ieee.org
This paper shows the result of working out the operations of permanent bonding of Si-Si
wafers and temporary bonding of Si-quartz wafers. The equipment was selected for the …

Impact of High-k Dielectric Material on Ultra-Short-DG-FinFET Performance

N Bourahla, B Hadri, NEI Boukortt… - … Systems and Services …, 2021 - ieeexplore.ieee.org
The miniaturization of the SOI-MOSFET transistor reducesthe gate electrostatic control and
reliability of the integrated circuit (IC). The fabrication of the transistor was reaching 7nm, but …

Effects of the Gate Dielectric Material on the Performance of a 14-nm SOI FinFET

NEI Boukortt, AM AlAmri, AG Loureiro… - … and Services in …, 2021 - ieeexplore.ieee.org
Fin field-effect transistors (FinFETs) are a type of device that has received great attention in
recent years, owing to their ability to scale down, low cost, and high efficiency for advanced …

Analysis of a Novel Nanoscale Vacuum Channel TF-FinFET

MP Kashyap, S Saini, R Chaujar - Silicon, 2021 - Springer
Concerned work is solely dedicated to the optimized characteristics of Nanoscale vacuum
channel TF (Truncated fin)-FinFET at gate length of 7 nm. NVCTF-FinFET has its own …