In this study, a novel low-silver Ag-xCu-5Ga (x= 28, 34, 39, 49 and 55) solder with high
strength was designed and prepared. The effect of element composition on microstructure …

In the realm of sustainable advancements, high-tech electronics plants have evolved
concomitantly with the innovations in environmentally conscious high-tech manufacturing …

Ball grid array (BGA) packages is a common type of electronic packaging and a crucial
component in electronic devices. However, its reliability is significantly compromised when …

Investigating the failure mechanism of solder joints under different temperature conditions is
significant to ensure the service life of a printed circuit board (PCB). In this research, the …

The dynamic reactions of uranium (U) with iron (Fe) minerals change its behaviors in soil
environment, however, how the coexisted constituents in soil affect U sequestration and …

The corrosion resistance of solder joints is a critical factor affecting the service life of
electronic products during long-term operation. In this study, the corrosion behavior of Sn …

In this study, the solidified microstructure and phase transition temperatures of Ag50. 5Cu33.
3Sn16. 2-xInx (x= 5.0, 6.6, 8.2, 9.1, 9.9, 10.7, 11.5, 12.3; at.%) alloys were investigated using …

The mechanical properties of embedded reinforcement seriously affect the stability of
rammed earth. However, more researches was focused on to analyze the mechanical …

The corrosion behaviors of Cu–7.42 Sn–0.156 P and Cu–5.78 Sn–0.162 P alloys in different
solutions were investigated. The results show that the Cu–Sn–P alloy with higher Sn content …

In the present work, the partial and integral enthalpies of mixing ternary Bi-Ni-Sn liquid
alloys were measured at 1000 C using the drop calorimetry method. The measurements …