A review of AI edge devices and lightweight CNN deployment
Abstract Artificial Intelligence of Things (AIoT) which integrates artificial intelligence (AI) and
the Internet of Things (IoT), has attracted increasing attention recently. With the remarkable …
the Internet of Things (IoT), has attracted increasing attention recently. With the remarkable …
[图书][B] Electronic design automation: synthesis, verification, and test
This book provides broad and comprehensive coverage of the entire EDA flow. EDA/VLSI
practitioners and researchers in need of fluency in an" adjacent" field will find this an …
practitioners and researchers in need of fluency in an" adjacent" field will find this an …
Analysis and comparison on full adder block in submicron technology
In this paper the main topologies of one-bit full adders, including the most interesting of
those recently proposed, are analyzed and compared for speed, power consumption, and …
those recently proposed, are analyzed and compared for speed, power consumption, and …
An implantable 64-channel wireless microsystem for single-unit neural recording
AM Sodagar, GE Perlin, Y Yao… - IEEE Journal of Solid …, 2009 - ieeexplore.ieee.org
This paper reports an implantable microsystem capable of recording neural activity
simultaneously on 64 channels, wirelessly transmitting spike occurrences to an external …
simultaneously on 64 channels, wirelessly transmitting spike occurrences to an external …
Review of bumpless build cube (BBCube) using wafer-on-wafer (WOW) and chip-on-wafer (COW) for tera-scale three-dimensional integration (3DI)
T Ohba, K Sakui, S Sugatani, H Ryoson, N Chujo - Electronics, 2022 - mdpi.com
Bumpless Build Cube (BBCube) using Wafer-on-Wafer (WOW) and Chip-on-Wafer (COW)
for Tera-Scale Three-Dimensional Integration (3DI) is discussed. Bumpless interconnects …
for Tera-Scale Three-Dimensional Integration (3DI) is discussed. Bumpless interconnects …
Energy-efficient noise-tolerant dynamic styles for scaled-down CMOS and MTCMOS technologies
MH Anis, MW Allam, MI Elmasry - IEEE Transactions on Very …, 2002 - ieeexplore.ieee.org
A new high-speed domino circuit, called HS-Domino has been developed. HS-Domino
resolves the tradeoff between performance and reliability in conventional CD-domino logic …
resolves the tradeoff between performance and reliability in conventional CD-domino logic …
[图书][B] Design of interconnection networks for programmable logic
G Lemieux, D Lewis - 2004 - Springer
The rapid advancement of semiconductor technology has required the concurrent
advancement of the digital systems design process. For example, early integrated circuits …
advancement of the digital systems design process. For example, early integrated circuits …
[图书][B] CMOS current-mode circuits for data communications
F Yuan - 2007 - books.google.com
Current-mode circuits, where information is represented by the branch currents of the circuits
rather than the nodal voltages as of voltage-mode circuits, possess many unique and …
rather than the nodal voltages as of voltage-mode circuits, possess many unique and …
Advanced thermal control using chip cooling laminate chip (CCLC) with finite element method for system-in-package (SiP) technology
This paper introduces a novel approach to address thermal management challenges in
system-in-package (SiP) technology, which is a significant concern in various advanced …
system-in-package (SiP) technology, which is a significant concern in various advanced …
[图书][B] The computer engineering handbook
VG Oklobdzija - 2001 - taylorfrancis.com
There is arguably no field in greater need of a comprehensive handbook than computer
engineering. The unparalleled rate of technological advancement, the explosion of …
engineering. The unparalleled rate of technological advancement, the explosion of …