Since the restriction of hazardous substances (RoHS) directive, lead-free soldering has
been widely broad adopted. In many applications, lead-free alloys have been substituted for …

Sn–Ag–Cu (SAC) solder alloys are frequently used in electronic assemblies, and their
fatigue resistance under various stress cycles is a significant factor that influences the …

One of the crucial factors in evaluating the reliability of an electronic appliance is fatigue
failure of the interconnecting solder joints. In most situations, large bulk samples are used to …

This work investigates the impact of Bi content on the microstructure of solder joints under
various thermal cycling conditions. Five lead-free solder alloys were used to assemble test …

This study aims to comprehensively understand the influence of bismuth (Bi) content on the
shear characteristics of solder joints under various aging conditions and strain rates. Three …

The reliability of SnAgCu (SAC)-based alloys has attracted considerable attention following
the restrictions on lead-based alloys in the electronics industry due to their toxic nature …

In realistic applications, the solder joint is continually subjected to thermal-mechanical stress
due to the difference in the coefficient of thermal expansion (CTE) between the printed circuit …

Sn-Ag-Cu-Bi (SAC-Bi) alloys are gaining popularity as a potential replacement for current
lead-free solder alloys in microelectronic packages. In this study, the tensile and viscoplastic …

Electronic assemblies are continually subjected to thermal–mechanical stres, leading to
failure mainly due to creep and fatigue mechanisms. The reliability of the assembly may be …

There is a growing interest in low temperature soldering, yet the use of low-melting point
alloys for interconnection is often hindered by reliability concerns. Eutectic tin-bismuth (SnBi) …