This positioning paper explores integrating smart in-process inspection and human–
automation symbiosis within human–cyber–physical manufacturing systems. As …

The aim of the study is to determine the frequency and usage of the TRIZ method, which
companies have recently used in order to develop creative solutions to the problems of the …

Ball grid array (BGA) package components are widely used in various electronic products,
as they shorten the conductive path and greatly reduce the interference during current …

Purpose This paper aims to discuss the key factors affecting the quality characteristics, such
as the number of solder balls, the spread distance of residual underfill and the completion …

Value engineering (VE) and function analysis (FA) are technological tools for the functional
enhancement and cost reduction of engineering projects. They also help to overcome …

This paper presents a new crowdsourcing approach to the construction of patent clusters,
and systematically benchmarks it against previous expert and algorithmic approaches …

Solder joints are the critical components of the printed circuit boards (PCBs) in the moving
electronic systems, such as satellites and automotive industries that are most vulnerable to …

ÖZET Şirketler artan rekabet koşullarında avantaj sağlamak için, çeşitli yöntemler kullanarak
yeni fikirler üretmeye ve sorunlarına yaratıcı çözümler geliştirmeye çalışmaktadırlar. Bu …

The capillary underfill (CUF) was used as the interconnection protection material in flip-chip
packaging since it offers significant improvement of the solder joint reliability. However, good …

Aiming at the problems of the current agricultural crusher device with winding shaft reamer,
outputting too long material, low pulverization rate, and ineffective treatment of high …