Critical properties of Cu6Sn5 in electronic devices: Recent progress and a review
As the most common of the intermetallic compounds (IMCs) formed between Sn-based
solders and Cu substrates during the packaging of integrated circuits (ICs), Cu 6 Sn 5 is …
solders and Cu substrates during the packaging of integrated circuits (ICs), Cu 6 Sn 5 is …
Effects of solder thickness on interface behavior and nanoindentation characteristics in Cu/Sn/Cu microbumps
Z Zhang, J Chen, J Wang, Y Han, Z Yu, Q Wang… - Welding in the …, 2022 - Springer
The thickness of the solder, for Cu/Sn/Cu microbumps with dimensions of tens of microns or
even a few microns (such as 40 µm, 15 µm, 10 µm, and 6 µm), can have a significant effect …
even a few microns (such as 40 µm, 15 µm, 10 µm, and 6 µm), can have a significant effect …
[图书][B] Electrical contacts: fundamentals, applications and technology
M Braunovic, NK Myshkin, VV Konchits - 2017 - taylorfrancis.com
Various factors affect the performance of electrical contacts, including tribological,
mechanical, electrical, and materials aspects. Although these behaviors have been studied …
mechanical, electrical, and materials aspects. Although these behaviors have been studied …
Magnetic nanoparticle-based solder composites for electronic packaging applications
Abstract Sn–Ag–Cu (SAC) alloys are regarded as the most promising alternative for
traditional Pb–Sn solders used in electronic packaging applications. However, the higher …
traditional Pb–Sn solders used in electronic packaging applications. However, the higher …
Deformation behavior of (Cu, Ag)–Sn intermetallics by nanoindentation
Nanoindentation is an important technique for probing the mechanical behavior of materials
at small length scales. In this study, nanoindentation was used to extract the elastic and …
at small length scales. In this study, nanoindentation was used to extract the elastic and …
[HTML][HTML] Co, In, and Co–In alloyed Cu6Sn5 interconnects: Microstructural and mechanical characteristics
The mechanical reliability of the future miniaturized interconnects is mainly governed by the
intermetallic compounds such as Cu 6 Sn 5. Alloyed Cu 6 Sn 5 with various elements …
intermetallic compounds such as Cu 6 Sn 5. Alloyed Cu 6 Sn 5 with various elements …
Elastic properties, hardness, and indentation fracture toughness of intermetallics relevant to electronic packaging
G Ghosh - Journal of materials research, 2004 - cambridge.org
Many intermetallics, such as Ag3Sn, AuSn4, Cu3Sn, Cu6Sn5 (η and η), Ni3Sn4, and γ–
Cu5Zn8 are present in modern solder interconnects as a result of solder chemistry and/or …
Cu5Zn8 are present in modern solder interconnects as a result of solder chemistry and/or …
Structural, electronic, and elastic properties of orthorhombic, hexagonal, and cubic Cu3Sn intermetallic compounds in Sn–Cu lead-free solder
In order to obtain a better understanding of the phase stabilities and mechanical behaviors
of Cu 3 Sn compounds, we performed first-principles calculations to predict the structural …
of Cu 3 Sn compounds, we performed first-principles calculations to predict the structural …
Nanoindentation identifications of mechanical properties of Cu6Sn5, Cu3Sn, and Ni3Sn4 intermetallic compounds derived by diffusion couples
PF Yang, YS Lai, SR Jian, J Chen, RS Chen - Materials Science and …, 2008 - Elsevier
We report in this paper Young's moduli and hardness of Cu6Sn5, Cu3Sn, and Ni3Sn4
intermetallic compounds (IMCs) measured by nanoindentation. The samples were prepared …
intermetallic compounds (IMCs) measured by nanoindentation. The samples were prepared …
High-temperature creep and hardness of eutectic 80Au/20Sn solder
YC Liu, JWR Teo, SK Tung, KH Lam - Journal of Alloys and Compounds, 2008 - Elsevier
Eutectic 80Au/20Sn solder is widely used for device packaging in optoelectronic and high
power electronic industries. The knowledge of thermomechanical properties of the solder is …
power electronic industries. The knowledge of thermomechanical properties of the solder is …